Industry News, Trends and Technology, and Standards Updates

North America Information & Control Committee Summer 2025 Update

Note: this will be the last blog published on cimetrix.com. For all future blogs, please visit our blog on PDF Solutions website.

Background

The SEMI North America, the Information & Control Committee meets three times per year, but this year the schedule is changed due to the SEMICON West  biennial  relocation to Phoenix beginning this year. SEMI held summer meetings in North America on June 2-4 at SEMI headquarters in Milpitas, CA. Like usual, the meetings are hybrid where attendees can join in person or remotely. The first two days are task force meetings including the GEM 300, ABFI (Advanced Backend Factory Integration), GUI, CDS (Fab & Equipment Computer & Device Security ) and DDA (Diagnostics Data Acquisition) task forces with Cimetrix task force leaders. The third day is the committee meeting where final decisions are made (usually) based on task force recommendations. This is a summary of what happened in some of the task forces and the committee meeting.

Note that all ballots that pass in the committee are still subject to a final review by the global SEMI Audit & Review committee, where a ballot technically can still fail when proper SEMI procedures and regulations are not strictly followed. This is rare in the North America Information & Control Committee but can happen and has happened.

A SNARF is a Standards New Activity Report Form. Before a task force can submit a ballot proposing a new standard or to modify an existing standard, the SNARF for this work must be approved by the technical committee.

Note that SEMI publishes a website with all global committee information where anyone can peruse the extensive details. It is at this website: https://www.semi.org/en/products-services/standards/developing-technical-standards.

Leadership Changes

Several leadership changes were approved during these meetings. For the last several years, Brian Rubow has been vice-chair of SEMI North America (NA) RSC Organization. During the NARSC meeting, Brian was nominated as co-chair. Alan Weber was nominated as co-leader of the Equipment Data Publication task force and co-leader of the Fab & Equipment Computer & Device Security Task Forces.

GEM 300 Task Force
Several weeks prior to meeting, Brian submitted a SNARF to the GEM 300 task force members for review. The SNARF proposes developing a new standard that enables secure GEM interface communication using gRPC technology and TLS. The new standard would be an alternative to the existing SECS-I and HSMS protocols used today. Neither of today’s protocols are secure and therefore present a cybersecurity risk. Feedback on the proposed SNARF indicates clear approval that we need a secure GEM protocol. However, the means to achieve security is still up for debate. Alternatives to gRPC offered by task force members include HTTP/2, WebSockets and secure TCP/IP communication. We discussed this a little at the task force meeting and plan to start meeting regularly to discuss and debate the alternatives until a technical solution is selected. We also decided to postpone approving any SNARF for this work until we decided on a technical direction. The addition of a secure protocol will be the big improvement to the GEM standard. Anyone interested in this topic should join the North America GEM 300 task force. The task force approved to work on ballots to modify the well-known implementations in four standards, E30 (GEM), E40 (Process Job Management), E87 (Carrier Management) and E90 (Substrate Tracking). In GEM, we wish to clarify the well-known naming for the Processing State Model collection events. Since every equipment can implement a unique Processing State Model tailored to its operation, the number and name of the Processing State Model collection events vary. We expect each of these ballots to be relatively small. The task force is also working on another ballot (7345) for the E90 (Substrate Tracking) standard related to batch processing. The current E90 standard is unclear how to report when batches are assembled and disassembled. The batch location state model has contradictions between the batch location states OCCUPIED and UNOCCUPIED and the transition tables. The ballot proposes a solution to the contradiction and additional collection events for batch assembly and disassembly. This ballot is ready for review by task force members and will be submitted for voting in the next voting cycle.

DDA (Diagnostics Data Acquisition) Task Force

The DDA task force remains very active while trying to finalize the EDA (Equipment Data Acquisition/Interface A) freeze 3 standards. All activities are focused on this goal. Ballot 7321A proposes changes to the core EDA standards, E120/E120.2, E125/E125.2, E132/E132.2, E134/E134.2 and E179. This ballot intends to be the final ballot for Freeze 3 for these core standards. It introduces one new feature, filtering E125 metadata to allow clients to request a subset of the equipment metadata when calling GetParameters, GetExceptions, and GetSimpleEvents. The other proposed changes reflect issues raised by task force members. These issues were raised either during the last vendor test session or since then as software development teams implement EDA Freeze 3 software. Both line items in the ballot failed and will be reworked for voting in Cycle 7 and adjudicated at SEMICON West in October. By failing the ballot, we can resolve the issues reported in ballot 7321B and resolve a few more issues reported since ballot 7321A was submitted. The final piece to EDA Freeze 3 is an update to the E164 standard (Specification for EDA Common Metadata). This ballot also failed and will be reworked for the next voting cycle. When these ballots (7321 and 7180) are approved and published by SEMI, we expect EDA Freeze 3 to be complete. Then we will modify standard E178 (Guide for EDA Freeze Version) to officially declare the EDA Freeze 3 version. In addition to this work, the DDA Task Force is also working on subordinate standards to E164. Each subordinate standard will standardize EDA metadata for one GEM-based standard, standardizing how to implement that standard in an EDA interface. The subordinate standard for E40 (process job management) is nearly ready for task force review. This work is outside the scope of EDA Freeze 3, only applicable when you implement the respective standard, but still directly related to EDA Freeze 3. This constitutes the bulk of remaining work.

ABFI (Advanced Backend Factory Integration) Task Force

The ABFI task for approved a SNARF to work on E142 to resolve some editorial changes and to add well-knowns to the subordinate standard E142.4. The task force is also working on a ballot to update the recently published E192 Guide for Equipment Adoption Criteria for GEM and GEM-Related Standards. Since this guide was published, two new standards related to GEM were published including the new Cybersecurity standard E191 and a new equipment data publication standard E190. This ballot has been submitted to the task force for review and will be submitted to SEMI in the next voting cycle.

CDS (Fab & Equipment Computer & Device Security) Task Force

SEMI standard E191 Specification for Computing Device Cybersecurity Status Reporting was published less than a year ago. The current version requires a GEM interface to publish two status variables to identify operating system information about the equipment’s factory facing computers. One identifies the computers, the other identifies the operating system manufacturer, name, version and build information. This helps factories identify cybersecurity risks within the factory and request upgrades. Ballot 7311A proposed to enhance the E191 standard by publishing additional information, introducing two additional status variables. One identifies the list of installed updates. The other identifies installed operating system components. This ballot passed and now awaits review by the Audit & Review committee before publication.

Next Steps

The North America Information & Control Committee will use SEMI voting Cycle 7 for the next round of ballots. Ballots are due to SEMI by Thursday, July 24 2025. These ballots will be adjudicated at SEMICON West October 6-8 at the Phoenix Convention Center.

Topics: Industry Highlights, SECS/GEM, Semiconductor Industry, Smart Manufacturing/Industry 4.0, Cimetrix Products, Standards

Posted by Brian Rubow: Director of Solutions Engineering on Jun 16, 2025 11:00:20 AM
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