Industry News, Trends and Technology, and Standards Updates

Advanced Process Control Conference XXXI:  Retrospective and New Standards News

APC2019-1The 31st annual APC Conference is now in the history books, and the diversity of topics, presenters, and local distractions made it well worth the visit to San Antonio! This year’s agenda featured half-day tutorials on the basics of APC and cyber-security, keynotes from chip makers and leading suppliers on automotive industry requirements, smart equipment, and smart manufacturing, and a series of packed technical sessions covering sensors and equipment control, fault detection and feedforward/feedback control, advanced analytics, and standards.

One of the presentations in the standards session provided detailed information about the new SEMI SMT-ELS (Surface Mount Technology Equipment Link Standards) M2M (machine-to-machine) communications standard. Alan Weber made the presentation titled “SEMI Standards to Support APC for Post-Fab Operations” to an interested audience, which triggered a number of discussions about the automation roadmap for the semiconductor assembly and test segment. This was especially relevant, since some of the leaders of the newly formed SEMI Advanced Backend Factory Integration Task Force (ABFI TF) were also present.

APC2019pic2The SMT-ELS standard has come a long way in a short time, and the ambitious, integrated demonstration created by 4 major SMT suppliers (Fuji, Juki, Panasonic, Yamaha) that was exhibited in June (Japan) and August (China) will again be shown in productronica (Munich, 13-15 November). The basic functions of SMT-ELS (officially designated at SEMI A1, A1.1, and A2) appear in the figure below.

APC2019pic3Cimetrix will likewise demonstrate this new standard at productronica, showing not only an equipment-level implementation of the M2M features but also the host-based configuration process and a plug-in for doing protocol validation tests.

Smart Manufacturing was a common theme this year, with an entire session dedicated to this global initiative. The Factory Integration section of the IRDS (International Roadmap for Devices and Systems) will be reorganized around the tenets of Smart Manufacturing, and a two-volume multi-industry book on this body of technology is scheduled for publication early next year. Another of Alan Weber’s presentations was dedicated to this topic, as he wrote the chapter chronicling the semiconductor industry’s development and use of these technologies.

APC2019pic4If you would like any further information, you can speak with a Cimetrix expert, or you can stop by our booth at productronica this week (Hall A3 booth 451). 

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Topics: Industry Standards, Doing Business with Cimetrix, Events, Smart Manufacturing/Industry 4.0

Posted by Alan Weber: Vice President, New Product Innovations on Nov 11, 2019 9:15:00 AM
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