Industry News, Trends and Technology, and Standards Updates

SEMICON Taiwan 2020 is coming soon and our Taiwan team will be there! You can read about it now in Traditional Chinese or below in English

SEMICON Taiwan將是SEMI的第一個全面的實體虛擬活動。這與Cimetrix的業務完全吻合，我們將在智能製造大廳的K3068號展位展出。

我們知道今年是史無前例的，許多人將無法前往台灣。但是，我們想邀請所有能夠參加展會的人前來參觀，看看Cimetrix的新功能！ （您也可以在演出前隨時與我們安排會議）！

Cimetrix將在SEMICON Taiwan上展示我們的最新產品和尖端技術。這包括我們的設備控制平台演示，EDA產品以及GEM連接性和一致性測試產品。我們還將能夠提供有關SEMI標準和SEMI技術的一些最新更改的更新。

我們也很高興宣布今年的演講嘉賓：我們的新產品創新副總裁艾倫·韋伯（Alan Weber）和我們的台灣總經理李孟修（Michael Lee）將就“半導體智能製造：業務驅動器，技術的不斷發展的紐帶和標準”發表演講。於9月24日星期四上午11:30會見專家展位（J3146）

祝大家安全健康地進行展覽。儘管我們的許多全球團隊都會錯過此次展會，但我們的台灣團隊和合作夥伴將隨時準備回答您的所有問題。我們希望看到你在那裡！

SEMICON Taiwan will be SEMI’s first comprehensive physical-virtual event, and will take place during September 23-25 at TaiNEX 1 (Nangang Exhibition Center) in Taipei, Taiwan with the theme “Leading the Smart Future.” This is perfectly aligned with the business of Cimetrix, and we will exhibit in the Smart Manufacturing hall at booth K3068.

We know this year is unprecedented and many will not be able to travel to Taiwan. However, we would like to invite everyone who is able to attend the show to stop by and see what’s new with Cimetrix! (You can also schedule a meeting with us at any time before the show)!

Cimetrix will showcase our latest products and cutting-edge technologies during SEMICON Taiwan. This includes our equipment control platform demonstrations, EDA products and GEM connectivity and compliance testing products. We will also be able to give updates on some of the latest changes to the SEMI Standards and SEMI technologies.

We are also excited to announce our speaker this year: Alan Weber, our VP of New Product Innovations, and Michael Lee, our General Manager in Taiwan, will speak on the topic of “Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards” at the SEMI Meet the Experts Booth (J3146) on Thursday, September 24 at 11:30 a.m.

We wish everyone a safe and healthy exhibition. While many of our worldwide team will miss being at the show, our Taiwan team and our partners will be available and ready to answer all your questions. We hope to see you there!

Hi folks! We in the CCF (CIMControlFramework) Services Team love training/consulting on CCF implementations and building custom software for our customers. We’re especially thrilled when we can help our customers ship new equipment and subsequently hear that the equipment successfully ran thousands millions of cycles without issues.

Recently, we enjoyed helping one of our customers build a tool that processes non-wafer substrates. The tool control system included some typical components such as Rorze Hardware Drivers, Light Tower drivers, and a Load Port E84 IO Control, but had some more unique capabilities as well. In this posting we will explore some of the challenges posed and advantages realized from these special capabilities. Before we dive in, please allow me to give a shout out to John Last, our Senior Software Engineer who designed and built most of these capabilities.

Process Module Operation Screen

Rather than simply logging data points, our customer wanted a visual representation of temperature over time (minutes). We displayed the categorized variables and their values in tables as well, but the graph updating in real time made it much easier for the operator to visualize the patterns and identify risk events and their sources. The graphing feature needed to be active whether or not the process module operation screen was being displayed. Moreover, It had to handle 3 different step types (Ramp, Dwell and Cool).

Calculating the Y-Axis range for this display presented an additional interesting challenge. The minimum and maximum values were determined by searching all recipe steps and selecting the lowest and highest value setpoints, then subtracting a fixed number from the lowest to get the Y-Axis minimum value and adding a fixed number to the highest value to get the Y-Axis maximum value. The figure below shows how the expected process data should look compared to the observed process data. This allows the operator to see what the equipment is expected to do compared with its actual behavior.

Partial FOUP grouping to create a single batch

Our customer required the capability to group multiple partial FOUPs into a single batch. This is especially useful in scenarios where partially filled FOUPs would be used—say, in R&D environments. In other words, we needed to support scenarios where the number of FOUPs needed for processing a batch exceeded the number of load ports. This required us to create Control Jobs with a MtrlOutSpec containing a valid SourceMap with an empty DestinationMap. We relied on SEMI E94’s concept of “Late Announcement of Output FOUP” to specify the input FOUP but not the output FOUP. This allows the scheduler to say, “We know the substrate will go to a different slot, but we won’t tell you which slot until later.”

E90 substrate reading in the Panel solution

As with most tools, each of the substrates has an ID, and this ID must be read and reported to the host. In this case, our host had to verify that the expected ID matched the actual ID. On a successful match, the equipment would then continue the job. If it failed, however, the host would be notified and decide whether to proceed or change something. Capabilities like these maximize throughput and mitigate risks to equipment safety side and production scrap.

Different Panel Types

This machine was required to deal with panels having multiple thicknesses and possible warpage. Therefore we needed to provide a method for an operator, the recipe, and the host to specify the panel type to be processed. None of the variations of panel types were known ahead of time, so we needed methods that handled additional panel types without having to make code changes after the equipment was deployed in production.

The tool also required different substrate mapping parameters for each panel type. Because panel type was specified in the process program referenced in the Process Job, the panel type was not known when the FOUP arrived at the load port. To handle this situation, we customized a standard factory automation SECS II message to communicate the panel type from the host to the tool on arrival of the FOUP.

Conclusion

This equipment was built on an extremely aggressive timeline by a very small team. I was particularly impressed by the team’s ability to grasp the end customer’s requests and creatively explore alternative ways to solve the never-before-seen challenges. In summary: no drama; a few delays; even fewer verbal altercations; just a little frustration; only a little scope creep; and most important, a satisfied factory customer. We all cheered when our customer shipped the tool in 2020.

To find out more about CIMControlFramework and our CCF Services team, or to contact us for a demo, click the button below.

Background

The SEMI North America Diagnostic Data Acquisition (DDA) task force is part of the North America Information and Control Committee (I&CC or NA I&CC). This year the meeting that is normally held in conjunction with SEMICON West was held on Tuesday, July 14, 2020, and continued its activities in developing important SEMI standards. As co-leader of the NA DDA task force, I offer this blog as a summary of the current task force activities.

Freeze 3 Status

The primary responsibility of the DDA task force is the suite of Equipment Data Acquisition (EDA) standards, sometimes referred to as “Interface A.” Currently there are two version sets of EDA standards known as “Freeze 1” and “Freeze 2” which are both based on SOAP/XML over HTTP. The current activities are focused on defining the next EDA set (already designated “Freeze 3”) which is based on a binary protocol gRPC over HTTP. This technology, along with a number of other changes, promises to dramatically increase data collection throughput capacity.

Here is what has been completed so far:

Current Ballot Activity

The bulk of the “Freeze 3” work is still under active development. Here is a summary of the ballot activity as of the start of the meeting on Tuesday.

All of the ballots failed and will be reworked for Cycle 7 voting later this year. However, this was not unexpected, and a great of useful feedback was gathered in the process.

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged at: http://downloads.semi.org/web/wstdsbal.nsf/TFOFandSNARFsbyCommittee?OpenView&Start=1&Count=1000&ExpandView

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. The North America DDA task force community is called “Diagnostic Data Acquisition Task Force - North America”.

To find out more about the semi standards, or to speak with a standards expert, click the button below:

Background

The SEMI North America Advanced Backend Factory Integration (ABFI) task force is part of the North America Information and Control Committee (I&CC or NA I&CC). Normally this task force meets every July in San Francisco as part of SEMICON West. However, this year the technical committee meetings are spread out over several weeks and do not coincide directly with the exhibition. Additionally, the I&CC did not meet at all because SEMI regulations do not currently allow TC Chapter (Committee) voting in virtual meetings. That will hopefully change later this year, but for now delays SEMI standards development.

Regardless of these challenges, the ABFI task force did meet on Monday July 13, 2020 and continues to develop SEMI standards. I am co-leader of the NA ABFI task force along with Dave Huntley of PDF Solutions. This blog is a summary of the current task force activities.

Wafer Maps

Ballot 6648 to update to the SEMI E142 (Specification for Substrate Mapping) specification has passed initial voting and is recommended to be accepted and published. This ballot significantly enhances the amount of traceability data that may be embedded within wafer maps.

Additional Wafer Map Activity

Because wafer maps will potentially be much larger with additional traceability data, they could be too large for the messages currently defined in the E142.2 standard. A new activity has been started to modify wafer map usage further and to allow Stream 21 messages to be used for wafer map transfer. The stream 21 message in the SECS-II standard can be used to transfer very large items through a GEM interface.

SEMI Standard Usage Matrix for Backend

The ABFI task force is also defining a matrix that specifies which standards beyond GEM (E30), SECS-II (E5), HSMS (E37) and Substrate Mapping (E142) should be used for backend automation, and under what conditions they should be used. This includes consideration of the full suite of GEM 300 standards and other standards that all GEM interfaces should consider, such as SEDD (E172) and SMN (E173).

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged at http://downloads.semi.org/web/wstdsbal.nsf/TFOFandSNARFsbyCommittee?OpenView&Start=1&Count=1000&ExpandView

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. The North America ABFI task force does not have a community.

To learn more about the standards, or to speak with a standards expert, click on the button below:

Cimetrix is pleased to announce and welcome Thomas Simon as its Director of Sales of Cimetrix Europe and Managing Director of Cimetrix GmbH. Thomas is based in Munich, Germany and will lead our growth in Europe. Thomas Simon will be responsible for ensuring the success of our growing customer base of leading semiconductor equipment manufacturers and smart manufacturing factories in Europe, providing strategic direction for Cimetrix Europe to have long-term success in the European market, overseeing local sales and account management and leading an expert team of Europe-based software engineers.

Thomas earned a Master of Science in Electronics and Semiconductor Technology and has 29 years of experience in the semiconductor, semiconductor backend, and electronics industries. He started his career as a field service engineer and then field service management working for companies such as Robert Bosch, SPTS (KLA), Centrotherm, UNAXIS (Evatec) and Suss MicroTec. Since 2011, Thomas has worked for Ulvac as Director of Sales and Business Development.

“Cimetrix has been serving European customers in the semiconductor and electronics markets for over 20 years. We have worked hard to gain a reputation for high quality products that are backed by responsive and exceptional technical support. Today, this provides us with a solid foundation of many longtime customers willing to serve as enthusiastic references. We also see strong and growing demand for Industrie 4.0 and Smart Manufacturing solutions. Accordingly, Cimetrix made the strategic decision to hire an experienced professional to lead Cimetrix’s business in Europe. We are very fortunate to have found Thomas Simon, as his vast experience in the semiconductor and electronics industries is a great fit with Cimetrix. We look forward to growing the Cimetrix team in Europe to provide even higher levels of support to our European customers.” 

-Bob Reback, President and CEO

Cimetrix has been building international teams throughout the world to provide our clients with technical experts who work in their local time zones, speak their native languages, and understand their unique cultures. In all of the major regions for semiconductor and electronics manufacturing, we now have an experienced executive who serves as that region’s Managing Director and is able to help our customers be successful and receive the highest levels of technical support.

To contact Thomas, please click the button below. Welcome Thomas!

To our Cimetrix shareholders,

One of the highlights of the year is the annual Cimetrix shareholder meeting, which is typically held in August at the Company’s headquarters office in Salt Lake City. We always enjoy the gathering of shareholders and reporting on the Company’s progress. The 2020 annual meeting has been on the calendar for Friday, August 14, and our hope was things would be back to normal by that time. Unfortunately, there has been a recent surge in COVID-19 cases in Utah, and we believe it would not be prudent to host the annual shareholder meeting at this time. Our number one concern is the safety of our shareholders and employees. Consequently, the Cimetrix 2020 annual meeting is officially postponed until further notice.

While the Company’s business has been impacted by COVID-19, we have transitioned to enable all employees to work from home. Demand within the semiconductor and electronics industries remains strong for our products, and we believe we are on track to meet our overall 2020 plans. Cimetrix has retained all of its valuable employees and is in the process of recruiting additional team members.

Once we set a new date for the annual shareholder meeting, we will report it on our website and send out another notice to shareholders. We thank our shareholders for their concerns and support.

Sincerely,

Bob Reback
President and Chief Executive Officer

For future updates and investor information, please visit our Investor Relations Page.

Background

The SEMI North America GEM 300 task force is part of the North America Information and Control Committee (I&CC or NA I&CC). Normally this task force meets in San Francisco as part of SEMICON West. However, this year the technical committee meetings are spread over several weeks and don’t coincide directly with SEMICON West. Additionally, the I&CC did not meet at all because SEMI regulations do not currently allow TC Chapter (Committee) voting in virtual meetings. That will hopefully change later this year, but for now inhibits the pace of SEMI standards development.

However, the GEM 300 task force did meet on Monday July 13, 2020, and continues to develop SEMI standards. I am co-leader of the NA GEM 300 task force, along with Chris Maloney from Intel. This blog is a summary of the current task force activities.

Pre-Meeting Summary

The table below contains a summary of the worldwide activities related to the GEM 300 task force as of the start of this summer’s meeting. There are corresponding task forces in the Japan and South Korea regions which are also active.

Current Ballot Activity

Two ballots were adjudicated during the most recent GEM 300 task force meeting. For those of you new to the standards development process, the term “adjudication” means that we review the results of the voting and recommend handling of all negative votes and comments received. The recommendations by the task force are then presented to and finalized at the committee level. Since the North America I&CC did not meet, the failed and super-clean ballots are being transferred to other regions (probably Taiwan) for further processing. Passed ballots with any negatives or comments are put on hold until NA I&CC meets so that the merits of the comments and overridden negatives can be evaluated.

6552A E5

This ballot modifies the E5 SECS-II standard. The ballot included three line-items, each of which is voted on separately

1. This is the most exciting activity in this ballot because it will give GEM host software much better tools for managing and testing GEM data collection. The first line item proposed adding several new messages to the E5 standard including a message to:
   1. Query the list of defined report identifiers
   2. Query report definitions
   3. Query a list of event report links
   4. Query the list of enabled events (this could already be done using Status Variable EventsEnabled)
   5. Query the list of streams and functions configured for spooling
   6. Query the list of defined trace identifiers
   7. Query trace definitions

1.  
2. Establish proper definitions for status variables, data variables and equipment constants. Additionally, deprecate the usage of the data item “DVNAME” which has generated confusion for years since it means a data variable identifier and not a data variable name.
3. Clarify the usage of message S7F17/F18. This message allows deletion of one or more recipes, but only returns a single acknowledgement code. The new clarification defines what to expect when an error is returned.

Each of the line items had at least one comment or negative; therefore, none was super-clean. The GEM 300 task force decided to pass line items 1 and 3, but fail line item 2.

6598A E37

The primary purpose of this ballot is to clarify some confusing text related to the T8 timer. Additionally, there are other improvements related to recommended settings. The GEM 300 task force decided to fail this ballot.

New Ballot Activity

Here is a summary of the next set of ballots to expect from the NA GEM 300 task force planned to be presented for Cycle 7 voting later this year.

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged at http://downloads.semi.org/web/wstdsbal.nsf/TFOFandSNARFsbyCommittee?OpenView&Start=1&Count=1000&ExpandView

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. The North America GEM 300 task force community is called “GEM 300 Task Force - North America”.

To find out more about SEMI Standards, GEM300, or to talk to standards expert, click the button below. 

Welcome to the first posting in the Cimetrix CIMControlFramework (CCF) Services blog series! While Cimetrix has been providing professional services for many years, in order to better serve the growing demand from many new equipment maker customers worldwide that have purchased our CCF product, Cimetrix earlier this year formed a new CCF Services group, reporting directly to the CEO. Being a senior developer at Cimetrix for the past 15 years in a variety of positions, I was delighted when asked to lead this group. We have an outstanding team of software engineers highly experienced in factory automation, equipment control software and SEMI standards. We are dedicated to ensuring our customers’ success by providing training, consulting, and developing custom solutions for our CCF customers. We love learning about the myriad ways that companies can integrate CCF with their equipment to meet the material handling and factory automation requirements of their factory customers. Our goal for these articles is to share some of the lessons learned and other implementation insights to help you efficiently build manufacturing equipment that is sophisticated, robust, and productive. To this end, our first posting will deal with one of the most common requests we get – enjoy!

- Forward by Brent Forsgren, Director of CCF Services

How we helped a customer deliver a GEM-compliant equipment using CCF

The Goal

One of our recent customers wanted to build a new type of LED manufacturing equipment that could be controlled by a Factory Host using the standard GEM Remote Commands: PP_SELECT (Process Program Select), START, STOP, ABORT, PAUSE and RESUME. The equipment could be delivered in a variety of physical configurations, including 1-to-multiple source cassettes for product material, and 1-to-multiple process modules. It also had multiple destination cassettes to be filled according to the post-process analysis results. The initial instance of the equipment had 4 loadports (LPs) and four process modules (PMs).

The functional requirements were clear – that was the good news. Now for the rest of the story… the project schedule and budget constraints were closing in, so we needed to work quickly and efficiently with the customer to get it done. Sound familiar?

The Approach

The Cimetrix CCF Services team always works closely with the software team of the equipment manufacturer. In this case, we started with one week of mutual discovery and in-depth hands-on training. Team members were fully engaged and picked up the CCF capabilities very quickly. This included even some of the more advanced features, such as developing a scheduler that would control the components of the customer’s application. We regularly fine tune training modules to 1) introduce CCF concepts, 2) expose common challenges and potential approaches, and 3) provide realistic implementation practice exercises. As anticipated, the customer was able to use the results of the training exercises in the actual equipment control solution. We also kicked off the project with our work-breakdown exercise to more deeply explore the unique requirements for their specific equipment type.

After an intense first week, everyone on the project team concluded that CCF would in fact be a strong match for their needs. CCF features direct integration with our CIMConnect, CIM300, and CIMPortal connectivity products to provide full GEM, GEM300 and EDA compliance. Because the Cimetrix connectivity products are deployed in every semiconductor 300mm factory in the world, our customers can be assured that they will meet their customer’s factory automation requirements. In this application, the end customer’s LED factory only required GEM.

To address requirements that may go beyond the basic GEM standards, CCF also provides support for custom remote commands, data publication, and alarm management. Finally, CCF supports integrating custom hardware devices using CCF’s base Equipment Classes.

To prove all was working, we chose the Cimetrix EquipmentTest product to develop and execute a set of unit tests that emulate communications with the factory software using GEM messages. This was not intended to be a comprehensive set, but rather just enough to show the equipment passed round-trip system testing. In this context, round trip means showing that the equipment can move material from the incoming cassette to the aligner to the process module and back into the cassette. EquipmentTest also supports editing message settings and parameters on the fly to experiment with different configurations of a round-trip test.

The Challenge: “The Host is unavailable, but we need to validate that the equipment is both GEM compliant and accomplishes the communication flows the end user requires.”

We get this challenge a lot… Our customers almost always develop the host interface and the embedded control software in parallel and integrate them later in the project. This makes sense at one level, but it does introduce a “chicken and egg” problem for testing this kind of GEM interface. In particular, how can our customer provide evidence that the solution will work with the factory host without testing with the actual host system? Our answer: apply our EquipmentTest custom plugin capability to simulate the end user’s host so we can validate all necessary communication between host and equipment.

Our protocol validation product, EquipmentTest, makes it possible to simulate communications between an equipment control implementation and the host. And although it is impractical to implement scenarios for every possible interaction, we can create enough representative scenarios to be confident the “happy path” (i.e., no errors) will work and that the interface will handle a large handful of “sad path” cases as well.

Outcome

We passed all the tests! “Let’s go get some tacos.”

Specifically, we validated that the communications interface supported…

• Standard GEM Remote Commands
• Custom Remote Commands
• Material tracking
• Data publication

In closing, we must emphasize that our customer should take most of the credit here. Nevertheless, we enjoyed observing, consulting, and testing the equipment. It is always gratifying to see the CCF solution fit so seamlessly into the hardware, execute its commands with optimal timing, and not break anything in the process! Truly a successful, joint team effort.

If the situation above resonates with your current challenges and past experiences, give us a call. We look forward to working with your software engineering team to speed your time-to-market and deliver a high-quality solution quickly, allowing your team members to focus on developing value-added functionality for your customers.

Feature by Ranjan Chatterjee, CIMETRIX
and Daniel Gamota, JABIL

Abstract

The vertical segments of the electronic products manufacturing industry (semiconductor, outsourced system assembly, and test, and PCB assembly) are converging, and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain, as well as the introduction of equipment and processes across the segments. The ability to develop smart manufacturing and Industry 4.0 enabling technologies (e.g., big data analytics, artificial intelligence (AI), cloud/edge computing, robotics, automation, IoT) that can be deployed within and between the vertical segments is critical. The International Electronics Manufacturing Initiative (iNEMI) formed a Smart Manufacturing Technology Working Group (TWG) that included thought leaders from across the electronic products manufacturing industry. The TWG published a roadmap that included the situation analysis, critical gaps, and key needs to realize smart manufacturing.Article First Posted by SMT007 Magazine

Introduction

The future of manufacturing in the electronics industry is dependent on the ability to develop and deploy suites of technology platforms to realize smart manufacturing and Industry 4.0. Smart manufacturing technologies will improve efficiency, safety, and productivity by incorporating more data collection and analysis systems to create a virtual business model covering all aspects from supply chain to manufacturing to customer experience. The increased use of big data analytics and AI enables the collection of large volumes of data and the subsequent analysis more efficient. By integrating a portfolio of technologies, it has become possible to transition the complete product life cycle from supplier to customer into a virtual business model or cyber-physical model. Several industry reports project manufacturers will realize tens of billions of dollars in gains by 2022 after deploying smart manufacturing solutions. In an effort to facilitate the development and commercialization of the critical smart manufacturing building blocks (e.g., automation, machine learning, or ML, data communications, digital thread), several countries established innovation institutes and large R&D programs. These collaborative activities seek to develop technologies that will improve traceability and visualization, to enable realtime analytics for predictive process and machine control, and to build flexible, modular manufacturing equipment platforms for highmix, low-volume product assembly.

The vertical segments of the electronic products manufacturing industry (semiconductor (SEMI), outsourced system assembly, and test (OSAT), and printed circuit board assembly (PCBA) are converging, and service offerings are being consolidated. This occurrence is due to the acceleration of technology development and the market dynamics, providing industry members in specific vertical segments an opportunity to capture a greater percentage of the electronics industry’s total profit pool.

The convergence of the SEMI, OSAT, and PCBA segments will cause shifts in the flow of materials across the supply chain, as well as the introduction of equipment and processes across the segments (e.g., back-end OSAT services offered by PCBA segment). OSAT services providers are using equipment and platforms typically found in semiconductor back-end manufacturing, and PCBA services providers are installing equipment and developing processes similar to those used by OSAT.

The ability to develop smart manufacturing technologies (e.g., big data analytics, AI, cloud/ edge computing, robotics, automation, IoT) that can be deployed within the vertical segments as well as between the vertical segments is critical. In addition, the ability to enable the technologies to evolve unhindered is imperative to establish a robust integrated digital thread.

As the electronic products manufacturing supply chain continues to evolve and experience consolidation, shifts in the traditional flow of materials (e.g., sand to systems) will drive the need to adopt technologies that seamlessly interconnect all facets of manufacturing operations. The iNEMI Smart Manufacturing TWG published a roadmap that would provide insight into the situation analysis and key needs for the vertical segments and horizontal topics (Figure 1) ^[1].

In this roadmap, the enabling smart manufacturing technologies are referred to as horizontal topics that span across the electronics industry manufacturing segments: security, data flow architecture, and digital building blocks (AI, ML, and digital twin).

The three electronics manufacturing industry segments SEMI, OSAT, and PCBA share some common challenges:•

• Responding to rapidly changing, complex business requirements
• Managing increasing factory complexity
• Achieving financial growth targets while margins are declining
• Meeting factory and equipment reliability, capability, productivity, and cost requirements
• Leveraging factory integration technologies across industry segment boundaries
• Meeting the flexibility, extendibility, and scalability needs of a leading-edge factory
• Increasing global restrictions on environmental issues

These challenges are increasing the demand to deploy, enabling smart manufacturing solutions that can be leveraged across the verticals.

Enabling Smart Manufacturing Technologies (Horizontal Topics): Situation Analysis

Many of the challenges may be addressed by several enabling smart manufacturing technologies (horizontal topics) that span across the electronics industry manufacturing segments: security, data flow, and digital building blocks. The key needs for these are discussed as related to the different vertical segments (SEMI, OSAT, and PCBA) and the intersection between the vertical segments.

Members of the smart manufacturing TWG presented the attribute needs for the following: security, data flow, digital building blocks, and digital twin. Common across the vertical segments is the ability to develop and deploy the appropriate solutions that allow the ability to manufacture products at low cost and high volume. Smart manufacturing is considered a journey that will require hyper-focus to ensure the appropriate technology foundation is established. The enabling horizontal topics are the ones that are considered the most important to build a strong, agile, and scalable foundation.

Security Security is discussed in terms of two classes: physical and digital. The tools and protocols deployed for security is an increasingly important topic that spans across many industries and is not specific only to the electronics manufacturing industry. Security is meant to protect a number of important assets and system attributes that may vary according to the process (novel and strong competitive advantage) and perceived intrinsic value of the intellectual property (IP).

In some instances, it directly addresses the safety of workers, equipment, and the manufacturing process. In other cases, it transitions toward the protection of electronic asset forms, such as design documents, bill of materials, process, business data, and others. A few key considerations for security are access control [2], data control [3], input validation, process confidentiality, and system integrity [2].

At the moment in manufacturing, in general, IT security issues are often only raised reactively once the development process is over and specific security-related problems have already occurred. However, such belated implementation of security solutions is both costly and also often fails to deliver a reliable solution to the relevant problem. Consequently, it is deemed necessary to take a comprehensive approach as a process, including implementation of security threat identification and risk analysis and mitigation cycles on security challenges.

Data Flow

General factory operations and manufacturing technologies (i.e., process, test, and inspection) and the supporting hardware and software are evolving quickly; the ability to transmit and store increasing volume of data for analytics (AI, ML, predictive) is accelerating. Also, the advent and subsequent growth of big data are occurring faster than originally anticipated. This trend will continue highlighting existing challenges and introducing new gaps that were not considered previously (Figure 2).

As an example, data retention practices must quickly evolve; it has been determined that limitations on data transmission volume and length of data storage archives will disappear (e.g., historical data retention of “all” will become standard practice). Examples of data flow key considerations are data pipes, machine-tomachine (M2M) communication, and synchronous/ asynchronous data transmission.

A flexible, secure, and redundant architecture for data flow and the option considerations (e.g., cloud, fog, versus edge) must be articulated. The benefits and risks must be identified and discussed. Data flow and its ability to accelerate the evolution of big data technologies will enable the deployment of solutions to realize benefits from increases in data generation, storage, and usage. These capabilities delivering higher data volumes at real-time and nearreal- time rates will increase the availability of equipment parameter data to positively impact yield and quality. There are several challenges and potential solutions associated with the increases in data generation, storage, and usage; capabilities for higher data rates; and additional equipment parameter data availability.

The primary topics to address are data quality and incorporating subject-matter expertise in analytics to realizing effective on-line manufacturing solutions. The emergence of big data in electronics manufacturing operations should be discussed in terms of the “5 Vs Framework”:

1. Volume
2. Velocity
3. Variety (or data merging)
4. Veracity (or data quality)
5. Value (or application of analytics)

The “5 Vs” are foundational to appreciate the widespread adoption of big data analytics in the electronics industry. It is critical to address the identified gaps—such as accuracy, completeness, context richness, availability, and archival length—to improve data quality to support the electronics manufacturing industry advanced analytics ^[4].

Digital Building Blocks

The advancements in the development of digital building blocks (interconnected digital technologies) are providing digitization, integration, and automation opportunities to realize smart manufacturing benefits. These technologies will enable electronics manufacturing companies to stay relevant as the era of the digitally- connected smart infrastructure is developed and deployed. Several technologies considered fundamental digital building blocks are receiving increased attention in the electronics manufacturing industry (e.g., AI, ML, augmented reality, virtual reality, and digital twin).

AI and ML

AI and ML tools and algorithms can provide improvements in production yields and quality. These tools and algorithms will enable the transformation of traditional processes and manufacturing platforms (processes, equipment, and tools). The situation analysis for AI and ML, as well as their enablers, typically consider the following features and operational specifications: communications at fixed frequency, commonality analysis, material and shipment history and traceability, models for predicting yield and performance, predefined image processing algorithms, secure gateway, warehouse management systems.

AI and ML present several opportunities to aggregate data for the purpose of generating actionable insights into standard processes. These include, but are not limited to, the following:

1. Preventive maintenance: Collecting historical data on machine performance to develop a baseline set of characteristics on optimal machine performance, and to identify anomalies as they occur.
2. Production forecasting: Leveraging trends over time on production output versus customer demand, to more accurately plan production cycles.
3. Quality control: Inspection applications can leverage many variants of ML to fine-tune ideal inspection criteria. Leveraging deep learning, convolutional neural networks, and other methods can generate reliable inspection results, with little to no human intervention.
4. Communication: It is important for members of the electronics manufacturing industry to adopt open communication protocols and standards ^[5–8].

Digital Twin Technology

The concept of real-time simulation is often referred to as the digital twin. Its full implementation is expected to become a requirement to remain cost-competitive in legacy and new facility types. Digital twin will initially be used to enable prediction capabilities for tools and process platforms that historically cause the largest and most impactful bottlenecks. The ultimate value of the digital twin will depend on its ability to continue to evolve by ingesting data and the availability of data with the “5 Vs”: veracity, variety, volume, velocity, and value. The situation analysis of the digital twin within and between electronics industry manufacturing segments highlight the following data considerations: historical, periodic, and reactive.

The concept of a digital twin lends itself to on-demand access, monitoring and end-toend visualization of production, and the product lifecycle. By simulating production floors, a factory will be able to assess attainable projected KPIs (and what changes are required to attain them), forecast production outputs, and throughputs through a mix of cyber-physical realities (the physical world to the virtual world, and back to the physical world), and expedite the deployment of personnel and equipment to manufacturing floors worldwide.

Enabling Smart Manufacturing Technologies (Horizontal Topics): Key Attribute Needs

Security

Security will continue to be a primary concern as the electronics manufacturing industry adopts technologies and tools that rely on ingested data to improve manufacturing quality and yield and offer differentiated products at a lower cost and higher performance. SEMI members generated a survey to appreciate the needs, challenges, and potential solutions for security in the industry and its supply chain and gather more comprehensive input from the industry in terms of users, equipment and system suppliers, security experts, and security solution providers ^[9]. It is a topic that permeates many facets of manufacturing: equipment, tools, designs, process guidelines, materials, etc. Processes continue to demand a significant level of security to minimize valuable know-how IP loss; this requirement will generate the greatest amount of discussion such as data partitioning, production recipes, equipment, and tool layout. A few key attribute needs for security are network segmentation ^[10], physical access, and vulnerability mitigation.

These security issues are not unique to microelectronics manufacturing, and many of the issues go beyond manufacturing in general. The topic of security should reference the challenges and potential solutions across the manufacturing space. As an example, the IEC established an Advisory Committee on Information Security and Data Privacy ^{[11figuredfdafdfd}. It is suggested to collaborate with other standards and industry organizations that are developing general manufacturing security roadmaps by delineating specific microelectronics manufacturing issues and focusing on common needs.

Data Flow

The development of a scalable architecture that provides flexibility to expand; connect across the edge, the fog, and the cloud; and integrate a variety of devices and systems generating data flow streams is critical. A smart factory architecture may, for example, accommodate the different verticals in the electronics manufacturing industry as well as companies in non-electronics manufacturing industries.

As mentioned previously, different industries seeking to deploy smart manufacturing technologies should leverage architectures thatprovide the desired attributes; data flow architecture is considered a prime candidate for leveraging and cross-industry collaboration to identify optimum solutions (i.e., data synchronizers, execution clients).

The development and deployment of technologies for data flow are accelerating. Focus on data analytics, and data retention protocols are increasing at a faster rate than first anticipated. It is imperative to collect the critical data as well as to establish guidelines to perform intelligent analysis and to exercise the appropriate algorithms to specify data-driven decisions. Several topics related to data are under consideration, such as general protocols:

• “All” versus “anomaly” data retention practices
• Optimization of data storage volumes
• Data format guidelines for analytics to drive reactive and predictive technologies
• Data quality protocols enabling improvements in time synchronization, compression/uncompression, and blending/merging
• Guidelines to optimize data collecting, transferring, storing, and analyzing

Data considerations for equipment are:

• Defining context data sets for equipment visibility
• Improving data accessibility to support functions
• Data-enabled transition from reactive to redictive functionality
• Data visibility of equipment information (state, health, etc.)

Digital Building Blocks

The ability to deploy the necessary digital building blocks to realize smart manufacturing is at different stages of maturity.

AI and ML

A few key attribute needs for AI and ML are data communication standards, data formatting standards, and 3PL tracking solutions. Technologies, such as AI and ML, are seen as enablers to transition to a predictive mode of operation: predictive maintenance, equipment health monitoring, fault prediction, predictive scheduling, and yield prediction and feedback. This paradigm in AI-enhanced control systems architectures will enable the systems to “learn” from their environment by ingesting and analyzing large data sets. Advanced learning techniques will be developed that improve adaptive model- based control systems and predictive control systems. The continued development and assessment of AI and ML technologies is critical to establish the most robust and well-tuned prediction engines that are required to support emerging production equipment.

Digital Twin Technology

Advances in digital twin technologies are accelerating as the potential benefits are communicated to end-users. Also, the costs for enabling technologies (hardware and software platforms) are becoming less expensive. The following are considered key attribute needs that will increase adoption and broad-based deployment of the digital twin (product design, product manufacturing, and product performance: digital thread, predictive, prescriptive, and systemwide continuous data access.

Digital twin is a long-term vision that will depend on the implementation of discrete prediction capabilities (devices, tools, and algorithms) that are subsequently integrated on a common prediction platform. It is generally considered that the digital twin will provide a real-time simulation of facility operations as an extension of the facility operations system.

The successful deployment of digital twin in a facility environment will require high-quality data (e.g., accuracy, velocity, dynamic updating) to ensure the digital twin is an accurate representation of the real-time state of the fab. Also, the realization of this vision will depend on the ability to design an architecture that provides the key technologies to operate collaboratively by sharing data and capabilities. Ultimately, the success of the digital twin will depend on the ability to develop a path for implementation that provides redundancy and several risk assessment gates.

Prioritized Research, Development, and Implementation Needs

The topic of collaboration is often mentioned in industry-led initiatives as a key element to realize the benefits attributed to smart manufacturing. There is a strong drive by members of the electronics manufacturing industry to engage in activities that foster collaboration. Participants in these activities recognize that solutions must be consensus-based and adopted by many vendors. Equipment suppliers appreciate that deep domain knowledge combined with data analysis contributes to only a fraction of the potential value that can be captured. The optimal value will be realized when data is shared across manufacturing lines in facilities, with vertical segment industry supply chain members and across vertical segments.

Example prioritized research, development, and implementation needs topics are as follows:

• Define data flow standard interfaces and data formats for all equipment and tools
• Investigate if data flow continuity between vertical segments should be mandatory or optional
• Determine optimal operation window for the latency of data versus process flow and quantify permissible latency for data flow when used to determine process go/no-go
• Investigate data security and encryption requirements when sharing common process tools versus isolating process equipment between vertical segments
• Develop open and common cross-vertical-segments communication standards and protocols for equipment

Gaps and Showstoppers

There is universal agreement that digitization will drive huge growth in data volumes. Many predict that cloud and hybrid cloud solutions are critical to enable the storage and subsequent manipulation of data by AI algorithms to derive value. However, industry members must adopt consensus-based standards and guidelines for connectivity protocols and data structures (Figure 4). Smart manufacturing is a journey, and a robust and scalable connectivity architecture must be established on which to deploy digital building blocks (e.g., AI, ML to extract the optimal value from the data). 

Example critical gaps that could significantly impact the progress of the deployment and adoption of smart manufacturing are:

• Undefined data security between vertical segments
• Lack of machine interface standardization for data flow
• Undefined data formats for data flow
• Data vulnerability when security is breached
• Robust and scalable connectivity architecture across electronics vertical segments to enabling smart manufacturing functionality (event and alarm notification, data variable collection, recipe management, remote control, adjustment of settings, interfacing with operators, etc.)

Summary

The iNEMI Smart Manufacturing Roadmap Chapter provides the situation analysis and key attribute needs for the horizontal topics within the vertical segments as well as between the vertical segments. Also, the chapter identifies the primary gaps and needs for the horizontal topics that must be addressed to enable the realization of smart manufacturing:

• Definitions: Smart manufacturing, smart factory, Industry 4.0, AI, ML, etc.
• Audits for smart manufacturing readiness: Develop consensus-based documentation, leverage published documents (e.g., Singapore Readiness Index ^[12])
• Security: Best practices, physical, digital, local and remote access, etc.
• Equipment diversity and data flow communications: Old, new, and mixture
• Data attribute categorization and prioritization: Volume, velocity, variety, veracity, and value
• Cost versus risk profile versus ROI
• Talent pool (subject-matter experts): Data and computer scientists, manufacturing engineers, and automation
• Standards and guidelines: Data formats and structures, communication protocols, and data retention
• Open collaboration: SEMATECH 2.0

The gaps and needs that were identified for addressing require additional detail for the status of the different vertical segments to appropriately structure the initiatives. It was suggested to circulate surveys to gather the information to appreciate the issue. One survey format was suggested as an example template: Manufacturing Data Security Survey for IRDS FI Roadmap ^[13].

iNEMI, together with other organizations, such as SEMI, can organize workshops to facilitate collaboration between the electronics manufacturing industry stakeholders. In addition, iNEMI can establish cross-industry collaborative projects that can develop the enabling technologies to address the roadmap identified needs and gaps to realize smart manufacturing.

Further, organizations, such as iNEMI and SEMI, can collaborate to establish guidelines and standards (e.g., data flow interfaces and data formats) as well as lead groups to develop standards for equipment and tool hardware to reduce complexity during manufacturing. Also, iNEMI can engage other industry groups to foster the exchange of best practices and key knowledge from smart manufacturing initiatives.

The members of the roadmap TWG are committed to provide guidance during the smart manufacturing journey—people, processes, and technologies. Members of the TWG also suggested engaging microelectronics groups as well as non-microelectronics groups to assess opportunities to leverage existing smart manufacturing guidelines and standards.

Acknowledgments

Thank you to the members of the iNEMI Smart Manufacturing TWG. Their dedication, thought leadership, and deep appreciation for SMT enabling technologies was critical to preparing the roadmap chapter.

In addition, we would like to thank the participants and facilitators of the SEMI Smart Manufacturing Workshop—Practical Implementations and Applications of Smart Manufacturing (Milpitas, California, on November 27, 2018). SMT007

References

1. 2019 iNEMI Roadmap.
2. U.S. National Institute Standard and Technology’s Special Publication 800-82.
3. U.S. National Institute Standard and Technology’s Special Publication 800-171.
4. IEEE International Roadmap for Devices and Systems, Factory Integration.
5. Japan Robot Association’s Standard No. 1014.
6. SEMI E30-0418, Generic Model for Communications and Control of Manufacturing Equipment (GEM); SEMI A1-0918 Horizontal Communication Between Equipment; SEMI E5-1217, Communications Standard 2 Message Content (SECS-II); SEMI E4-0418, Equipment Communications Standard 1 Message Transfer (SECS-I).
7. Hermes Standard.
8. IPC-CFX Standard.
9. J. Moyne, S. Mashiro, and D. Gross, “Determining a Security Roadmap for the Microelectronics Industry,” 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), pp. 291–294, 2018.
10. IEC 62443 3-2.
11. website: iec.ch/acsec.
12. EDB Singapore, “The Singapore Smart Industry Readiness Index,” October 22, 2019.
13. www.surveymonkey.com/r/ZXLS6LH.

Ranjan Chatterjee is vice president and general manager, smart factory business, at Cimetrix.

Dan Gamota is vice president, manufacturing technology and innovation, at Jabil.

Article First Posted by SMT007 Magazine

Feature by Ranjan Chatterjee, CIMETRIX
and Daniel Gamota, JABIL

Editor’s note: Originally titled, “The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing ” this article was published as a paper in the Proceedings of the SMTA Pan Pacific Microelectronics Symposium and is pending publication in the IEEE Xplore Digital Library.

Cimetrix is proud to announce that Ranjan Chatterjee, Executive Vice President of Smart Factory Solutions at Cimetrix, has been newly elected to the iNEMI Board of Directors. 

iNEMI, The International Electronics Manufacturing Initiative is a not-for-profit, highly efficient R&D consortium of approximately 90 leading electronics manufacturers, suppliers, associations, government agencies and universities.

iNEMI roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact deployment projects. These projects support their members' businesses by accelerating deployment of new technologies, developing industry infrastructure, stimulating standards development, and disseminating efficient business practices. They also sponsor proactive forums on key industry issues and publish position papers to focus industry direction.

In the official press release from iNEMI, they explain “The iNEMI Board plays an integral role in the governance of our organization,” said Marc Benowitz, CEO. “They provide oversight for our operations, including decisions regarding policy, strategy and direction of the consortium. These recently elected individuals bring a high caliber of leadership, as well as supply chain diversity, to our Board. We welcome the new and returning Directors and look forward to working with them.”

In addition to being elected to the Board of Directors, Mr. Chatterjee has also had the opportunity to Co-Chair the Smart Manufacturing Roadmap with Dan Gamota from Jabil.

Cimetrix is excited to play a role in the ongoing mission of iNEMI.