Industry News, Trends and Technology, and Standards Updates

PDF Solutions and Cimetrix by PDF Solutions are exhibiting at SEMICON West 2023 in less than a week and we hope to see you there!

SEMI is the principal industry association that represents the global electronics manufacturing supply chain, and regularly brings industry leaders together to drive the future of electronics and advanced semiconductor manufacturing. SEMICON West is one of its premier annual industry events, and this year’s gathering will take place July 11-13, 2023 at the Moscone Center in San Francisco, California with the theme “Building a Path Forward.”

At SEMICON West 2023, The Cimetrix Connectivity Group (CCG) of PDF Solutions will exhibit our latest software solutions that are designed to improve manufacturing quality and productivity. You can find us at booth #344 as well as a variety of other places during the exhibition. Be sure to stop by any of the following activities:

• John Kibarian (CEO, PDF Solutions) will participate In DAC Research Panel "Why Is Curvy Design an Opportunity Now?" (July 11 at 1:30 pm)
• Greg Prewitt (Director, PDF Solutions) will speak at the Test Vision Symposium on "Enhanced Parametric Test Insights Through Dynamic Data-Driven Test Flow Execution" (July 12, 11:15 am)
• Ranjan Chatterjee (VP, Cimetrix Connectivity Group) will chair the AI/ML Enabled Manufacturing Operations Panel (July 12 at 2:00 pm @ Smart Manufacturing Theater)
• Alan Weber (VP, Cimetrix Connectivity Group) will present "Connecting the Dots: From KPIs to Smart Manufacturing Applications to Industry Standards" (July 13 at 10:35 am @ Meet the Experts Theater)
• Ming Zhang (VP, PDF Solutions ) will participate In a panel discussion "From Assembly Line to Field: The Future Semiconductor Testing" (July 13 at 3:40 pm @ Test Vision Symposium)
• PDF Solutions presentation at AWS booth #1841
• Exensio and proteanTecs daily demos - DAC booth #2449 at 2:30 pm and SEMICON booth #1834 at 11:30 am

At our booth (#344) we will showcase the latest versions of all our industry-leading solutions, as well as our Smart Factory platform, Cimetrix Sapience. Stop by to speak with an industry expert, or contact us by clicking the button below and let us answer all your questions!

Background

At SEMI in North America, the Information & Control Committee meets three times per year; spring summer and fall. This year the spring meetings were held on April 3-5. The meetings include task forces with leaders from Cimetrix on the GEM 300, ABFI (Advanced Backend Factory Integration), GUI, DDA, CDS task forces as well as the committee meeting on the final day. This is a summary of what happened in the task forces I am highly involved in including GEM 300, ABFI and DDA. 

GEM 300 Task Force

After very busy previous GEM 300 task force meetings over the last couple of years, this is the first time in a long time that the GEM 300 task force did not have a major ballot up for voting. A major update to the GEM standard (SEMI E30), ballot 6572C, is awaiting publication at SEMI but was previously approved. In our task force meeting this week, we primarily discussed a new ballot proposed by a couple of active task force members regarding SEMI E172, SPECIFICATION FOR SECS EQUIPMENT DATA DICTIONARY (SEDD). The proposed new ballot would enhance the E172 SEDD file to add: 

1. alarm names
2. a new “well known” element to all collection events, data variables, status variables, equipment constants and alarms.
3. enhanced comments in the schema file
4. possibly a few schema changes regarding the handling of empty lists

The major new feature is the “well known” element. When an equipment supplier creates a GEM interface on the equipment and related GEM 300 standards, the implemented SEMI standards define required collection events, data variables, status variables, equipment constants and alarms which much be available. However, the actual name for each required item published in the GEM interface is not specified in the standard and is not a strict requirement. As a result, implementations of GEM and GEM 300 standards use different names for the same required item. For example, the GEM standard requires collection event “Control State REMOTE” to notify when the operator changes the equipment to remote control. One implementation might call this collection event “ControlStateRemote” while other implementations might call this collection event “Control State REMOTE” or “CntrlStateREMOTE”. All of these names are valid and GEM Compliant. The “well known” element in the E172 SEDD file would allow items in the GEM interface to be assigned a tag mapping it to a required item in a SEMI standard. Each SEMI standard in turn will need to be updated to define “well known” names to use in the E172 SEDD File. This new feature will allow GEM host software to have increased plug-and-play intelligence when connecting to a GEM interface to identify standard features. EDA (Equipment Data Acquisition) interfaces solved this problem in the SEMI E164 standard. The proposed “well known” names to be used in a GEM interface are expected to use the same names currently found in SEMI E164. Then SEMI E164 can be updated to reference the same “well known” names. This will be a lot of work to standardize, but will be a valuable feature. The upcoming GEM revision already defines how an SEDD file can be transmitted through the GEM interface using Stream 21 messages. 

Additionally, the task force discussed SEMI E87 and the new carrier ready to unload prediction. Prior to these discussions on April 3, I had thought that the state model was stabilized enough to implement. However, the work for ballot 6835 has been redefined to include additional work to modify the state model yet again. With this redefined scope, a new ballot number will be issued by SEMI. The task force is investigating changing the state model to predict transition to a final carrier accessing state (carrier complete or carrier stopped) instead of predicting transition to the carrier ready-to-unload state. The assumption is that the time between carrier completion and ready-to-unload states is fixed, and that it might be more useful for internal buffer equipment to predict carrier completion instead than ready-to-unload. Additionally, a few of the states are proposed to be changed. 

Both activities are expected to happen quickly and be submitted for SEMI voting cycle 5 in 2023. 

ABFI (Advanced Backend Factory Integration) Task Force

A new specification (ballot 6924, Specification for Equipment Management of Consumable and Durables) and subordinate standard (ballot 6925, Specification for SECS-II Protocol for Equipment Management of Consumable and Durables) were submitted for voter feedback since the committee last met in the fall. During the Spring meetings, the voter feedback was adjudicated. The ABFI Task Force and the I&C (Information & Control) Committee agreed to fail ballots 6924 and 6925. There were a few technical mistakes in the ballots that need to be reworked. Most of the feedback identified editorial mistakes or improvements in the ballot. Only a few minor technical issues need to be ironed out. I will be reworking both ballots, seeking task force member feedback and submitting them to the upcoming SEMI Cycle 5 voting. The voting feedback from the last cycle makes me optimistic that the ballots will soon pass and become new standards. 

The task force also spent time discussing and debating SEMI E142 substrate maps and how they might be used in specific traceability situations. 

DDA (Diagnostics Data Acquisition) Task Force

The DDA task force and Information & Control committee pass several ballots proposed by the DDA task force including:

• Ballot 7001 – Revision to SEMI E125-1022 Specification for Equipment Self Description (EqSD) and SEMI E125.2-1022 Specification for Protocol Buffers for Equipment Self Description (EqSD)
• Ballot 7002 – Revision to SEMI E132-0922 Specification for Equipment Client Authentication and Authorization and SEM E132.2-0422e Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA)
• Ballot 7003 - Revision to SEMI E134-1022 Specification for Data Collection Management and SEMI E134.2-1022 Specification for Protocol Buffers of Data Collection Management
• Ballot 7017 - Line Item Revision To SEMI E120.2-0922: Specification For Protocol Buffers For Common Equipment Model (CEM)

All of these ballots are part of the effort to develop a “freeze 3” version of the EDA (Equipment Data Acquisition) standards, where the underling protocol will use gRPC and Protocol Buffer technology instead of the current SOAP and HTTP seen in EDA freeze versions 1 and 2. 

Ballot 7002 includes multiple editorial changes and technical changes. The technical changes will result in a Ratification ballot for SEMI Cycle 4 voting. If the Ratification ballot passes, then ballot 7002 will pass. But if it fails then ballot 7002 will also fail and have to be reworked. 

While handling the considerable work adjudicating all of the ballot negatives and comments, the task force considered some new cases. For example, the task force discussed the role of the Security Admin, and whether it should be used only for EDA interface management as designed today or whether it should also provide additional EDA diagnostics capabilities. 

For the first time in a very long time, no DDA ballots are proposed for the next voting cycle (other than the Ratification ballot). The task force co-leaders are hoping to let SEMI publication catch up and to plan another event where companies can test EDA against other implementations. The previous tests were limited to E132. Since then some major changes have been made to E132. The new tests would include testing E132, E125 and E134 together to ensure that the standards define compatible and useful EDA implementations. After these tests, it is expected that one more round of changes might be needed for E132, E125 and E134 to correct defects or missing features identified by members participating in this testing. 

Information & Control Committee

For the first time in a very long time, the committee meeting was unable to complete all planned business. To comply with SEMI regulations, the meeting was required to end on time with unfinished business. The unfinished business will be handled by the Information & Control GCS chairs. This group includes the co-chairs from the SEMI Information & Control Committees in North America, Japan, South Korea, Taiwan and China. 

Earlier this quarter (October 2022) the SEMI Smart Manufacturing Council conducted one of its regular meetings with factory stakeholders to determine what sort of SEMI-sponsored activities could accelerate this important industry initiative. One focus area of the discussion was getting more and better data out of the sub-fab, since the performance and integration of these components is becoming more important for many of the leading manufacturers. The related, familiar topic of achieving better visibility into equipment and process behavior was also raised.

In that context, as it often does, the role of industry standards came up as a key enabling technology. The following question was posed: “Are the current standards sufficient to support the broad range of smart manufacturing use cases that factories envision, or does more need to be done? Specifically, since the Information and Control Committee is working on the Freeze 3 version of the EDA (Equipment Data Acquisition, also known as Interface A) suite of standards, are there problems that need to be addressed to improve the adoption of usage of these standards?”

This question triggered a lively (but non-convergent!) conversation among the participants in the meeting, many of whom have years (no, decades) of experience working in the standards community. Before long, it became clear that the group had no clear answer to these questions, and that more information from the actual user community was needed. Someone suggested that the Council pose the questions to a broader audience in survey form, and this proposal was enthusiastically accepted. Several of us volunteered to generate a draft survey for SEMI’s review and refinement, which got the activity off to a running start.

Given this opportunity to connect directly with the ultimate beneficiaries of SEMI Standards, there was a temptation to broaden the survey’s scope to cover other topics of interest in the smart manufacturing domain. Cognizant of the fact that the longer surveys have a lower chance of being returned with useful data, however, the group largely resisted this temptation, including the most important questions in an easy-to-answer format, leaving room for optional additional information in the responses for those so inclined.  

The final survey was issued by SEMI around October 21,2022 with a requested response date of November 15 (which has been extended to gather more feedback). Rather than repeat the entire content here, I include the following excerpts from the introduction and the table of contents:

The purpose of this questionnaire is to assess the status of the industry’s experience with and impressions of the SEMI EDA (Equipment Data Acquisition) standards suite to guide current and future initiatives that improve its capabilities, communicate implementation best practices, and foster broader adoption to realize the vision of SEMI’s Smart Manufacturing Community.

Respondents to this questionnaire should include companies that have already deployed the EDA standards in volume production as well as those that have yet to do so. Respondents in the latter category can simply skip the questions about current usage/issues.

The target audience was originally thought to be stakeholders in 300mm wafer fabs, but with the growing interest in enhanced data collection and automation for backend (packaging, assembly, and test) factories AND growth in the 200mm wafer fab segment (including new models of 200mm manufacturing equipment), it has been broadened to include these domains as well.  

Most questions are posed in multiple choice format, but additional detail is always welcome in the Comments fields where appropriate.

SEMI will compile the responses and share the result with the industry while preserving the anonymity of individual responses.

1. Manufacturing Stakeholders
2. Manufacturing KPIs (Operational Performance)
3. Manufacturing Application Support
4. Automation Requirements and Equipment Acceptance
5. Current (or intended) Usage
6. Issues and Expectations
7. Other Data Collection Needs

Appendix – Stakeholders and Acronyms

 

 

Moreover, at this writing, the link to the on-line survey is still active here: 
à SEMI Equipment Data Acquisition / Interface A Standards Survey – Questionnaire on Usage, Requirements, Expectations, and Issues.

Finally, if you are interested in the details of the survey, and especially if you would like to provide your inputs directly to SEMI, you should contact Mark da Silva, Chair, SEMI Smart Manufacturing, Global Executive Committee, at mdasilva@semi.org.

And as always, to discuss your company’s specific Smart Manufacturing journey and to understand how we at Cimetrix by PDF Solutions can help, click on the contact button below. We look forward to hearing from you!

Background

The North America Information & Control Committee (I&CC or NA I&CC) is comprised of several task forces including GEM 300, Diagnostic Data Acquisition (DDA), Advanced Backend Factory Integration (ABFI), Fab & Equipment Computer and Device Security (CDS), and Graphical User Interfaces (GUI). These task forces and the committee all met during the week of SEMICON West, July 11-13, 202. Not long ago, SEMI regulations were modified to allow TC Chapter (Committee) voting in virtual meetings; therefore, the standards activities continue to move forward. In-person task force participation was much higher than the last meetings, but remote participation also remains strong. This blog is a summary of the activities in each task force.

GEM 300 Task Force

Here is a summary of worldwide activities related to the GEM 300 task force as of the start of the GEM 300 task force meeting.

Three ballots were adjudicated during the GEM 300 task force meeting. The term “adjudication” means we review the voting and recommend handling of all negative votes and comments received to ultimately accept the ballot for publication or reject the ballot for rework. The recommendations by the task force are then finalized at the committee meeting. Usually, the task force recommendation is accepted by the committee, as was the case in all three ballots.

6916 E5

This ballot proposes to modify the E5 SECS-II standard and included the following minor changes:

• Allow data variable OperatorCommand to be type ASCII.
• Correct various typographical errors
• Remove the dependency between variables MDLN (equipment model number) and EqpSerialNum (equipment serial number).

This ballot passed after the only negative was withdrawn by the voter.

6572B E30

This ballot proposes to modify the GEM (E30) standard. It is a revision ballot, meaning the entire E30 standard is subject to review. This is the third time the ballot has been submitted. It is a major update to the GEM standard and includes the following changes:

• Process Program Management changes
  • The terms “recipe” and “process program” are currently used nearly interchangeably. The proposal is to use the term “process program” exclusively.
  • References to E42, large formatted and large process programs are moved out of the main standard and into the appendix.
  • Stream 21 messages are introduced for process program management, including both the single and multiple message techniques. This provides a simplified way for GEM interfaces to upload and download large process programs.
  • The entire process program management section is vastly reorganized to help implementers understand the available alternatives and the scenarios for each available alternative. New tables were introduced to compare and summarize implementation alternatives.
  • Collection event ‘Process Program Error’ is specifically listed as required, rather than just as an implied requirement.
• A series of new SECS-II messages are introduced including S2F51-S2F64. These are new capabilities to make a GEM interface more transparent.
• S5F7/F8 is added to the alarm management capability for similar reasons.
• Two new GEM documentation features are added and made available through the GEM interface using Stream 21 messages including PDF documentation and SEDD (see SEMI E172) documentation. This should make it easier to distribute GEM documentation and ensure that the right documentation is referenced.
• Two new equipment identification features are added, one to identify the equipment supplier and one to uniquely identify each individual equipment. This should make it easier to identify and track specific equipment on the factory floor.
• Some changes related to terminology are included. SEMI regulations recently were updated with a list of restricted bias terminology which are not allowed in any SEMI standards and a list of terms to avoid when possible.

This ballot failed due to a disagreement regarding a proposed change to the GEM control state model collection on transition 10 related to the host off-line state. The task force remains evenly divided on this issue; therefore, this change will be withdrawn from the next revision of this ballot.

I am optimistic that the 6572C revision of this ballot will pass voting with little controversy. This ballot has already been distributed to the task force for final review. Little controversy remains unless some voter raises a new issue.

6859 E116

Originally ballot 6859 intended to add significant new features to the E116 standard. However, the aggressive changes have been abandoned. Instead, this ballot is focused on making one change to E116. Currently the E116 specification implements collection events in a manner inconsistent with E30, E40, E87, E90, E94, E109, and E157. This E116 ballot failed. After further discussion in the task force, consensus on the proposed changes seems possible in the next voting cycle. The updated ballot 6859A has already been submitted for review by the task force.

DDA Task Force

The DDA task force has been and continues to update the Equipment Data Acquisition (EDA a.k.a. Interface A) standards with the goal to approve an EDA Freeze 3 set of standards based on gRPC technology. To date the following ballots have been completed:

During these meetings, three DDA task force ballots failed adjudication, 6927 (E125, E125.2), 6928 (E132, E132.2) and 6929 (E134, E134.2) due to procedural errors which violated SEMI regulations. This is primarily due to a long backlog of publications on previously approved specifications. Discussions were held in several meetings in an attempt to find ways to help SEMI get caught up on publications. The delay in publication is partly due to the several large ballots that were backlogged when COVID activity prevented the committee from completing adjudication in remote or hybrid meetings.

Test Session #1

The most important activity for the DDA task force was “vender test session #1” held on Thursday, July 14. An open invitation was made to all task force members to participate in an E132 test session. Anyone could submit a client and/or equipment server implemented with the current E132 and E179 specifications. Four companies came together and ran tests against each other’s software. Each participant will provide the task force with a list of issues in E132 and E179. This was a great opportunity to try the gRPC technology together and get a sense of what issues still need to be resolved before EDA Freeze 3 is complete.

DDA Freeze 3 Plans

The DDA Task force plans an update to E125, E132, and E134 including changes from the recently failed ballots as well as topics raised in the test session. Due to the expanded scope, new ballot numbers will be issued. Additionally plans to update E164 are also moving forward. The biggest challenge for E164 will be converting the XML files into JSON files. Either JSON5 or JSONC will likely be used since comments are mandatory in the E164 complementary files which show how to create GEM 300 capable EDA equipment models.

ABFI Task Force

The Advanced Backend Factory Integration task force is actively working on two ballots.
One ballot is a minor update to the E142, the substrate mapping specification which facilitates traceability and other application where substrate, tray, feeder, and other information can be shared between a factory and equipment. The minor update will add additional substrate types so E142 substrate maps can be used in more applications.

Additionally, the task force is working on ballots 6924 and 6925. The 6924 specifications will define the management of Consumable and Durables on manufacturing equipment. Features include allowing the host to accept or reject newly mounted consumables and durables. Additionally, the equipment will be able to report on consumable and durable usage. While technically both can already be done, the specification establishes a standard way for the features to be implemented. The 6925 ballot maps 6924 for usage in a GEM interface. The plan is to submit the ballot for the next voting cycle.

GUI Task Force

The GUI task force continues to work on a major revision of the E95 specification for Human Interfaces for Semiconductor Equipment. In addition to updating the specification with changes in software development, this revision will establish requirements for the usage of human interfaces on equipment using devices with small screens. The task force seems to be gaining consensus of many topics and getting ready to submit the ballot for voting.

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged here.

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. Here are the community names for the task forces covered in this blog:

• GEM 300 Task Force - North America
• Diagnostic Data Acquisition Task Force - North America
• Fab & Equipment Computer and Device Security (CDS) Task Force – North America
• Advanced Backend Factory Integration (ABFI) Task Force – North America
• Graphical User Interfaces (GUI) Task Force - North America

Read now in Korean or below in English.

저희 씨메트릭스는 Forward As One이라는 테마로 코엑스에서 2월 9일부터 11일까지 개최되는 세미콘 코리아 2022행사에서 여러분을 반갑게 맞을 준비를 하고 있습니다. 부스는 C홀에서 D홀로 넘어온 통로 앞에 위치한 DS37입니다.

잠시 들리셔서 귀사에서 활용할 수 있는 최신 기술도 파악하시고 업계동향도 듣고 가시기를 바랍니다.
씨메트릭스는 이번 세미콘 코리아에서 다음의 주제를 가지고 여러분을 기다리도록 하겠습니다.

• AI, 빅데이터, 인더스트리 4.0기술을 활용한 분석 및 솔루션 개발
• 후공정 차세대 장비소프트웨어를 위한 플랫폼
• 전공정 장비소프트웨어의 고도화
• SEMI 표준 (SECS/GEM, GEM300, EDA/Interface A)
• 납기 단축을 위한 테스터 & 문서화
  
  

특히, 국내뿐 아니라 해외 진출을 목표로 하는 고객들에게 최고의 파트너로서 최선을 다할 것을 약속드립니다.

아무쪼록 이번 행사에서 저희 부스를 방문해주시기를 부탁드리며, 아래 링크에 접속하시면 사전 미팅예약을 할 수도 있습니다.

After being canceled in 2020 at the beginning of the pandemic, SEMICON Korea is now back, with a hybrid event where the exhibition is live and in-person! Our Korea team will be exhibiting at the COEX in Seoul from February 9-11 at booth DS37. We look forward to the show and hope to see many of you there!

The theme for this year’s show is Forward as One and the exhibition will showcase the latest semiconductor materials, equipment, and related technologies. This is a great opportunity to meet with current clients, potential clients and see both the present and future of the global semiconductor industry.

If you want to find out more about EDA/Interface A, Equipment connectivity, and control or learn about our Smart Factory Platform, be sure to stop by our booth at DS37 to speak with our standards and product experts. We look forward to meeting backend OEMs as well as frontend OEMs as both are looking for the next-generation technology but in different ways.

We hope to see you at our booth, or you can request a meeting any time by clicking the button below.

SEMICON Japan 2021 is back and our team in Japan will be there! You can read about it now in Japanese or below in English.

セミコンジャパン2021が東京ビッグサイトで12月15日から17日の3日間開催されます。　「共に前進しよう」のスローガンの下、弊社Cimetrixも出展致します。

Cimetrix独自のブースを以て出展する2回目のセミコンジャパンとなります。今年はブース番号＃1608にて皆さまのご来場をお待ちしております。また共同出展を行って頂ける、ローツェ株式会社様（＃5411）、株式会社明電舎様（＃4941）にても、Cimetrixのご案内を差し上げております。

半導体産業における製造技術、装置、材料をはじめ、車やIoT機器などのSMARTアプリケーションまでをカバーするエレクトロニクス製造サプライチェーン唯一の国際展示会。東京ビッグサイトでのリアル展示会に加えて、リアルとオンラインセミナーも提供し、今年は「SEMICON Japan 2021 Hybrid」として開催されます。

Cimetrixは私共が誇る世界標準としてご利用いただいておりますGEM通信、装置制御ソリューション、またEDAなどのソフトウェア製品をご紹介させて頂きます。

また生産現場でご利用いただけるハイパフォーマンスデータ収集のプラットフォームであるサピエンスもご紹介しております。　CimetrixのSapienceはクラウドネイティブのデータ解析やマシーンラーニング等にご活用いただける装置データ収集のパイプラインプラットフォームシステムです。

では皆さまのご来場を楽しみにしております。

SEMICON Japan 2021, with the theme “Move Forward Together” will be held at Tokyo Big Sight from 15 December – 17 December, and Cimetrix Incorporated will be there!

We will exhibit for the second year at booth #1608 and welcome you to come and join us. You can also find information about Cimetrix at our partner Rorze Corporation (booth #5411).

SEMICON Japan will be a hybrid show this year that offers both an in-person exhibition as well as programs and seminars online. It is a must-attend event that connects technologies in the digital transformation era, bringing together the entire semiconductor manufacturing supply chain as well as the “SMART” applications powered by semiconductor technology such as IoT.

Cimetrix will be showing all our world-class GEM equipment connectivity and control software solutions, as well as our EDA/Interface A products. These factory automation software products all leverage open-architecture designs and industry standards.

Cimetrix Sapience will also be available for a demo at our booth. Sapience is a scalable, distributed platform for managing high-performance data pipelines. This cloud-native platform is ideal for streaming analytics, machine learning, and artificial intelligence applications requiring massive amounts of data directly from the production equipment.

We encourage you to stop by booth #1608 and speak with an expert for your Smart Equipment and Smart Factory software needs. You can also book a meeting with us in advance by clicking the button below. We hope to see you soon!

After missing the live and in-person event last year due to the pandemic, SEMICON West is once again opening its doors to connect the entire electronics supply chain, and Cimetrix Incorporated will be exhibiting. Our booth is #345 and we hope you'll stop by and see us!

SEMICON West will be held December 5-7 in the Moscone Center in San Francisco, CA, USA – the theme for this hybrid event is "Explore, Network, Interact." After almost two years of restricted travel and virtual events, SEMICON West is a great place to reconnect with contacts, customers, and partners to drive your business forward. We couldn’t be more excited about finally meeting in person for the first time since 2019!

Cimetrix expert Alan Weber will participate in the "Optimizing Your Manufacturing—Connecting the Smart Way" track in the Smart Manufacturing Pavilion on Tuesday, December 7 at 2:45 PST. His presentation is titled “Accelerating Advanced Backend Automation Through Smart Application of Frontend 300mm Standards" and we invite you to join us at the Smart Manufacturing Pavilion to learn about this important topic firsthand.

Stop by our booth any time to visit with our team of experts and discuss our standards, connectivity, and control solutions. We will also feature our Smart Manufacturing cloud-native connectivity and application platform Cimetrix Sapience®. You can visit with us in our booth any time during the show or make an appointment ahead of time by clicking the link below.

Background

Cimetrix CIMConnect^TM customers enjoy many benefits to maintaining an active support contract, and today we are announcing yet another one: access to a set of product-specific training videos.

A few years ago, the Solutions Engineering team at the Cimetrix Connectivity Group posted product training material including the full set of CIMConnect training PowerPoint presentations to facilitate self-training for those unable to attend a formal session. We update this repository periodically as the training material is revised and improved. The material is available online through the Customer Portal. After logging in, you can find the presentations here:

Training Videos

To complement the presentation material shown above, the Solutions Engineering team is now creating video training material. As of mid-June, 2021, the first set of training videos for CIMConnect is also available via the customer portal (see below).

By clicking on the “CIMConnect Video Library”, you can see full set of available training videos and access them via this table:

The material is organized by topic, such as Collection Events or Status Variables. Each topic is subdivided into one or more instruction parts. When there is a lab, the implementation of the lab is covered twice. First, the implementation of the lab is reviewed and demonstrated in CIMConnect’s “Getting Started” sample application. Second, the lab is implemented step by step from scratch in a new application.

A few of the training PowerPoint presentations are not yet complete but should be available soon. This includes topics like Remote Commands, Equipment Constants, Factory Setup, and Operator Interface. Solutions Engineering plans to expand the training to other products as well.

Also, note that other videos are also available that go beyond the scope of the training material. These are found on the same “CIMConnect Video Library” page at the bottom.

Customers are welcome to purchase CIMConnect training and/or consulting services at any time. The training material described above is not a substitute for working directly with a product and standards expert, where a customer can discuss specific equipment hardware, software architecture, and unique customer requirements. Nevertheless, this material should help our customers when they need a refresher course and especially when new employees are assigned to work with CIMConnect after its initial development.

Next week, the world will once again gather at the industry’s leading trade fair for electronics development and production. The 2021 productronica and SEMICON Europa shows are open for in-person attendance and Cimetrix Incorporated will definitely be there. We hope to see many of you there as well!

The 2021 productronica show is co-located once again with SEMICON Europa in Munich, Germany from November 16-19 at the Messe München expo center. With safety protocols in place, Messe München is opening its doors to welcome the decision-makers and thought leaders from the industry to participate in showing new and innovative products and solutions spanning the entire value chain.

The Cimetrix booth will be in Productronica halls, where we will demonstrate our Smart Factory platform Cimetrix Sapience, to show how we can help with your smart manufacturing connectivity and application needs. Sapience, a cloud-native platform, features a distributed, scalable architecture for managing high-performance data pipelines from electronics equipment. As such, it is ideal for streaming analytics, machine learning, and artificial intelligence applications requiring data directly from the production equipment.

We are also highlighting an open position for a Munich-based Field Applications Engineer at the productronica career center and here on cimetrix.com.

We invite you to drop by our booth at productronica #437 in Hall A3, or you can make an appointment ahead of time by clicking the button below. We look forward to seeing you soon!

A little over 3 years ago, the Elsevier publishing company decided that the topic of Smart Manufacturing had achieved enough global breadth and momentum to warrant in-depth treatment in an edited set of articles. As they researched the domain, they realized that it split neatly into two categories of material: a general set of concepts that are applicable in any industry, and example implementations that are specific to a small set of related industries.

The editors then consulted with a number of industrial and academic subject matter experts to subdivide each category into a set of topics, and the Table of Contents for each of the two volumes was born. The results were first published in August 2020, and are available from Elsevier:

• Volume 1: Concepts and Methods (426 pages) 
  
  “Research efforts in the past ten years have led to considerable advances in the concepts and methods of smart manufacturing. Smart Manufacturing: Concepts and Methods puts these advances in perspective, showing how process industries can benefit from these new techniques. The book consolidates results developed by leading academic and industrial groups in the area, providing a systematic, comprehensive coverage of conceptual and methodological advances made to date.”
  
  
• Volume 2: Applications and Case Studies (528 pages) 
  
  “Research efforts in the past decade have led to considerable advances in the concepts and methods of smart manufacturing. Smart Manufacturing: Applications and Case Studies includes information about the key applications of these new methods, as well as practitioners’ accounts of real-life applications and case studies.”

One of the editors was Dr. Thomas F. Edgar, a long-time professor in the University of Texas Chemical Engineering department who specialized in process modeling, control, and optimization. He is also credited by many as being the “father of semiconductor APC" (advanced process control), since a number of his graduates ended up in the automation/process engineering department at AMD/Austin and transformed this domain from spreadsheets and “sneakernet” to a fab-wide, model-based process control system.

Needless to say, I was honored when he called to say that Elsevier wanted a case study on the semiconductor industry’s use of smart manufacturing, and to ask if I would write that section. I readily agreed, and provided the chapter titled “Smart Manufacturing in the Semiconductor Industry: An Evolving Nexus of Business Drivers, Technologies, and Standards.” The abstract for that chapter follows:

“The semiconductor industry embarked on its own “Smart Manufacturing” journey well over 30 years ago, long before the term was coined. The continuous productivity improvements that we now take for granted are essential for creating and building the devices that fuel our electronics-based global economy and maintaining commercial viability in a hypercompetitive industry. However, what we have learned in the process is that like many scientific endeavors, it is a journey without a destination. As new market opportunities are met with new device and system technologies in an ever-changing business environment, the list of manufacturing challenges is never complete.

This is where the global Smart Manufacturing initiative enters the picture. Although its key tenets are not specific to the semiconductor industry, the attention it drew to this topic triggered the formation of the SEMI Smart Manufacturing Community, which now provides a forum for thought leaders across the semiconductor manufacturing value chain to focus on these important challenges. To put this initiative in its proper perspective, this chapter explores the past, present, and future of Smart Manufacturing in the semiconductor industry.”

Regarding the Smart Manufacturing Initiative (now with chapters in several geographic regions), SEMI is the perfect host for such a group. Since its charter includes both trade and standardization activities for the industry worldwide, and its members develop the diverse technologies that comprise the electronics industry, SEMI forms an ideal backdrop for describing the evolution of semiconductor Smart Manufacturing. This is illustrated in the figure below.

Thinking back over my almost 50 years in the industry, I think the factor that contributed the most to the industry’s current success was the evolution of its collaboration culture. Whether driven by the need for industry efficiency, the fear of extinction, or the recognition of mutual interdependence, today’s global semiconductor industry enjoys a collaborative culture that is unequaled in other for-profit industries.

If the topic of Smart Manufacturing piques your interest, I invite you to visit the Elsevier websites shown above for more information. I have also distilled the semiconductor case study chapter into a set of slides that I will be happy to review/discuss with you.

We wish you the best on your company’s Smart Manufacturing journey – let us know how we can help!