Industry News, Trends and Technology, and Standards Updates

Cimetrix attended the recent JISSO PROTEC exhibition (June 5-7, 2019) at the Tokyo Big Sight International Exhibition Center to see the latest developments in SMT (Surface Mount Technology) manufacturing… and witnessed a truly compelling demonstration of the new SEMI Flow Manufacturing communications standards in action.

The new suite of standards is named SMT-ELS (Surface Mount Technology-Equipment Link Standards), and includes SEMI A1/1.1 as a lower-level messaging standard with SEMI A2 SMASH (Surface Mount Assembler Smart Hookup) defining the content of the messages required to configure an SMT manufacturing line and automate the material and information transfer among all equipment in that line. This is depicted in the figure below.

The demonstration itself included placement equipment from 4 large equipment suppliers—Fuji, JUKI, Panasonic, and Yamaha—as well as load/unload stations and a bar code reader at the beginning of the line (see picture below). Each of these companies had implemented the “horizontal” (machine-to-machine) communications according to the SMT-ELS standards. The demonstration consisted of an operator scanning one of the stack of input boards with the barcode reader, placing it on the loader conveyor, and then watching as each piece of equipment automatically adjusted its internal conveyor to accept the board, run through its part placement recipe, and pass the board to the next equipment in the line, finally arriving at the unload station conveyor after a minute or so.

Before a fully automated multi-vendor production SMT line can be implemented, more work on the standards is necessary, especially in the area of error handling and recovery. In addition, the suppliers of other (non-placement) equipment types must adopt this approach. However, given the factory benefit of mixing equipment from multiple suppliers to optimize line performance for a specific set of products, this is only a matter of time.

If you want to know more about the status and outlook of these standards, and how they can be implemented in your equipment or factory, please contact us.

Cimetrix participated in the recent European Advanced Process Control and Manufacturing (apc|m) Conference, along with over 150 control professionals across the European and global semiconductor manufacturing industry. This site of this year’s conference was Villach, Austria, a picturesque town nestled in the eastern Alps just north of the Italian border in the state of Carinthia. This region is home to a number of high-tech companies and institutions all along the semiconductor manufacturing value chain, and since it was the first time the conference was held in Villach, the local hosts rolled out the red carpet. 

This conference, now in its 19th year and organized by Silicon Saxony, is one of only a few global events dedicated to the domain of semiconductor process control and directly supporting technologies. As usual, the conference was very well organized, and featured a wide range of high-quality presentations, keynote addresses, and tutorial sessions. The supplier exhibits associated with this year’s event were especially numerous, as were the technical posters displayed in the exhibition area just outside the conference rooms.

As in many prior years, Cimetrix was privileged to present at this conference, as Alan Weber delivered a talk entitled “Addressing Connectivity Challenges of Disparate Data Sources in Smart Manufacturing.” The presentation highlighted the need for unifying data collection concepts—like explicit equipment models and generic structures for data collection plans—are increasing necessary for maintaining the fidelity of a factory’s “digital twin” in Smart Manufacturing settings where the number of data source types is growing. This presentation resonated with a number of the key conference themes, so if you want to know more, feel free to download a copy of the entire presentation from our web site.

Other highlights of the conference included:

• An update by Otto Graf on the ambitious vision and progress of the BOSCH 300mm wafer fab now under construction in Dresden. In this talk he emphasized the role that digital technologies will play in bringing up the fab and climbing the yield ramp and other features of a wall-to-wall Industrie 4.0 implementation. 
• “The Role of APC and Smart Manufacturing / Industrie 4.0 in New Reliability-Critical Markets“ by James Moyne (University of Michigan / Applied Materials) – James re-presented a number of the Smart Manufacturing technologies in the context of automotive industry requirements, especially the role that Subject Matter Expertise (i.e., people!) will play alongside other emerging technologies. He also pointed out that the Factory Integration chapter of the International Roadmap for Devices and Systems (IRDS) will be reorganized around the key tenets of Smart Manufacturing.
  
  
• A thought-provoking invited talk from Dr. Roman Kern of the KNOW-CENTER titled “Possibilities and Challenges of Digitalization in the Semiconductor and Other Domains.” His key messages started with “Big Data is the new oil…. AI is the new electricity… and Data Science is the new lingua franca for leading global industries,” and then he went deeper into all of these.
  
  
• Dr. Germar Schneider of Infineon Technologies built on the theme above in a practical setting with his “Chances and Challenges of Digitization in Semiconductor Fabs and Success Factors during the implementation” presentation. This was not only an in-depth look at some of the multi-year efforts at Infineon, but also included a summary of current digitization projects across the European manufacturing R&D community. 
  
  
• Another invited talk from BMW was delivered by Rainer Hohenhoff which covered “Product Data and Product Life Cycle Management in the face of new business models of the automotive industry.” In short, it discussed many of the ways a car company might make money even after people stop buying as many cars as they do today… and what collisions (pun intended) you could expect in the market as service companies like Google, Amazon, UBER, and others converge on the transportation consumer. 

There were poignant moments as well. After 19 years of personal dedication to this event, both Gitta Haupold of Silicon Saxony and Dr. Klaus Kabitzsch, Program Committee Chair from Technical University of Dresden are retiring. They will definitely be missed!

The insights gained from these and the other 30+ presentations are too numerous to list here, but in aggregate, they provided an excellent reminder of how relevant semiconductor technology has become for our comfort, sustenance, safety, and overall quality of life. 

This conference and its sister conference in the US are excellent venues to understand what manufacturers do with all the data they collect, so if this topic piques your interest, be sure to put these events on your calendar in the future. In the meantime, if you have questions about any of the above, or want to know how equipment connectivity and control fit into the overall Smart Manufacturing landscape, please contact us!

It’s time for another episode in our Giga Factory Minute series... And in keeping with the theme of moving around the clock, we see that the focus of this month is “process steps completed.” However, rather than focus on manufacturing processes, we’ll use this opportunity to highlight an important industry process that is underway. Specifically, I’m referring to the role that the automotive market has in quite literally “driving” important segments of the semiconductor and electronics industries. Even as portions of the industry forecast a slowdown over the next 6-9 months, those in the automotive sectors are busier than ever.

From a wafer fab standpoint, one of the biggest news items over the past 6 months has been announcement, groundbreaking, and construction of a new facility in Dresden, namely the Bosch RB 300 wafer fab. The automation aspects of this factory were featured in a very engaging presentation by Otto Graf (Managing Director, Robert Bosch Semiconductor Manufacturing Dresden GmbH) at the recent Innovationsforum for Automation in Dresden, Germany. 

A modern automobile is brimming with electronics, as you can see from the systems highlighted in the figure below. (Image courtesy of chipsetc.com)

Every function in a car, from engine control to seating to headlamps to collision avoidance is getting smarter… and this is a welcome sight for the scores of companies that provide the components that realize these functions.

But the full impact of automotive electronics includes all the infrastructure technologies external to the car, such as 5G telecommunications, “smart” roads and traffic signals, routing and congestion management systems for major cities, satellite systems that provide GPS information, entertainment content providers for the non-drivers, and law enforcement, just to name a few. And as driverless cars approach commercial feasibility, the scope and importance of these systems increase significantly.

In this context, anyone who thinks the “good old days” of the semiconductor and electronics industries are behind us isn’t paying attention -- so buckle up and prepare to enjoy the ride!

If your company plays a role in the manufacturing aspects of this exciting market, and you are struggling with how to address the equipment control and connectivity challenges you face, give us a call. We’ve got people who can help you make sense of it all, and products that can transform your problems into solutions.

In the first blog of this series, Clare Liu of Cimetrix China made the compelling case for choosing a commercial software platform for implementing the equipment side of the EDA (Equipment Data Acquisition) standards interface rather than developing the entire solution in-house. 

Whenever this “make vs. buy” decision is discussed, however, the following question inevitably arises: “If we choose a standard product for this, how can we differentiate the capabilities of our equipment and its data collection capability from our competitors?” It’s a great question which deserves a well-reasoned answer.

Platform Choice and System Architecture

Most advanced fabs use EDA to feed their on-line FDC (Fault Detection and Classification) applications, which are now considered “mission-critical.” This means if the FDC application is down for any reason, the equipment is considered down as well. It is therefore important to choose a computing platform for the EDA interface that is highly reliable and has enough processing “headroom” to support the high bandwidth requirements of these demanding, on-line production applications. Moreover, this platform should not be shared by other equipment communications, control, or support functions, since these may adversely impact the processing power available for the EDA interface. 

Surprisingly, this approach is not universally adopted, and has been a source of problems for some suppliers, so it is an area of potential differentiation. 

Adherence to Latest Standards 

The automation requirements for the most advanced fabs call for the latest versions (Freeze II) of all the standards in the EDA suite, including the EDA Common Metadata (E164) standard. Dealing with older versions of the standard in the factory systems creates unnecessary work and complexity for the fab’s automation staff, so it is best to implement the latest versions from the outset. The Cimetrix CIMPortal Plus product makes this a straightforward process using the model development and configuration tools in its SDK (Software Development Kit), so there is absolutely no cost penalty for providing the latest generation of standards in your interface.

It takes time and effort for equipment suppliers with older versions of the standards to upgrade their existing implementations, so this, too, is an opportunity for differentiation.

Equipment Metadata Model Content

This is probably the area with the largest potential for competitive differentiation, because it dictates what a factory customer will ultimately be able to do with the interface. If an equipment component, parameter, event, or exception condition is not represented in the equipment model as implemented in the E120 (Common Equipment Model) and E125 (Equipment Self-Description), and E164 (EDA Common Metadata) standards, the data related to that element cannot be collected. In effect, the metadata model IS the data collection “contract” between the equipment supplier and the fab customer.

This is why the most advanced fabs have been far more explicit in their automation purchase specifications with respect to equipment model content, going so far as to specify the level of detailed information they want to collect about process performance, equipment behavior, internal control parameters, setpoints and real-time response of common mechanisms like material handling, vacuum system performance, power generation, consumables usage, and the like. This level of visibility into equipment operation is becoming increasingly important to achieve the required yield and productivity KPIs (Key Performance Indicators) for fab at all technology nodes.

The argument about “who owns this level of information about equipment behavior” notwithstanding, providing the detailed information the fabs want in a structure that makes it easy to find and access is a true source of differentiation.

Self-Monitoring Capability

If you really want to set your equipment apart from your competitors, consider going well beyond simply providing access to the level of information needed to monitor equipment and process behavior and include “built-in” Data Collection Plans (DCPs) that save your customers the effort of figuring out what data should be collected and analyzed to accomplish this. Your product and reliability engineering teams probably already know what the most prevalent failure mechanisms are and how to catch them before they cause a problem… why not provide this knowledge in a form that makes it easy to deploy?

A few visionary suppliers are starting to talk about “self-diagnosing” and “self-healing" equipment… but it will be a small and exclusive group for a while – join them.

Readiness for Factory Acceptance

Before the fab’s automation team can fully integrate a new piece of equipment, it must follow a rigorous acceptance process that includes a comprehensive set of interface tests for standards compliance, performance, and reliability. This process is vital because solid data collection capability is fundamental for rapid process qualification and yield ramp that shorten a new factory’s “time to money.” If you know what acceptance tests and related software tools the fab will use (which is now explicit in the latest EDA purchase specifications), you can purchase the same software tools, perform and document the results of these same tests before shipping the equipment. 

This will undoubtedly speed up the acceptance process, and your customers will thank you for the effort you took to put yourself in their shoes. Incidentally, this usually means the final invoice for the equipment will be paid sooner, which is always a good thing.

In Conclusion

In this posting, we have only scratched the surface regarding the sources of competitive differentiation. As you can see, choosing a commercial platform enables this far more readily than the in-house alternative, because it allows your development team to focus on the topics above rather than worrying about compliance to the standards. If you’d like to know more, please give us a call or click below to talk schedule a meeting. 

We introduced the Giga Factory Minute concept last year to highlight the impact that standards have in orchestrating the entire manufacturing process, from releasing unpatterned wafers into the line (1:00 on the figure) to the shipment of good die to the downstream assembly/test facilities (12:00). This year, we’ll use this same diagram to identify important industry trends, technologies, events, or other items of interest to our subscribers. Since there are 12 “hours” on the diagram, watch for a posting every month related to the topic in that segment.

January 2019

Since this is January, we’ll focus on the more general topic of electronics manufacturing product materials, of which “wafer starts” is the specific material type that begins the 4-month journey through the wafer fab.

In the early days of the automated factory industry, there were only a few material form factors to deal with… even when you go all the way back to the raw silicon and forward to the finished electronic product. (You can see most of these on the “Sand to Systems” infographic here.)
However, now that semiconductors have found their way into virtually every major industry on the planet, from computers to entertainment to transportation to agriculture to wearables and even to “ingestibles,” the automated material handling challenges across this product diversity have exploded. And it’s only going to get worse.

You may not be responsible for handling exotic material types anytime soon, but understanding the role that equipment connectivity standards can have at the earliest steps in a Smart Manufacturing process is useful nevertheless. Give us a call if you’d like to know more about how these technologies can benefit your operations. 

Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in today’s leading-edge semiconductor gigafabs. In fact, the only way to comprehend the enormous volume of transactions that occur is to consider what happens in a single minute – this is illustrated in the infographic we have labeled “The Gigafab Minute.”* 

Cimetrix participated in the recent European Advanced Process Control and Manufacturing (apc|m) Conference, along with over 160 control systems professionals across the European and global semiconductor manufacturing industry. The conference was held in Dresden, a beautiful city in the Saxony state of Germany which was the site of the original European conference in 2000 and host to this annual event many times since.

This conference, now in its 18th year and organized by Silicon Saxony, is one of only a few global events dedicated to the domain of semiconductor process control and directly supporting technologies. The participants represented all links in the semiconductor manufacturing value chain, from universities and research institutes to component, subsystem, and equipment suppliers to software product and services providers to semiconductor IDMs and foundries across a wide spectrum of device types to industry trade organizations – something for everyone. 

As usual, the conference was very well organized, and featured a wide range of high-quality presentations, keynote addresses, and tutorial sessions. 

Highlights of the conference included the following:

• “FDC to the power of 2 – how it got us to the next level of manufacturing excellence“ by Jan Räbiger of GLOBALFOUNDRIES – one of a number of long-time thought leaders in the development and application of APC technology, Jan described the latest phase of FDC system evolution, which includes broad use of the EDA/Interface A standards to zero in on recipe step-specific anomalies that had previously escaped detection.

• “Applying the Tenets of Industrie 4.0 / Smart Manufacturing to Microelectronics Next Generation Analytics and Applications“ by James Moyne (University of Michigan / Applied Materials) – James presented a very nice decomposition of the domain into 6 topic areas (Big Data Environment, Advanced Analytics and Applications, Supply Chain Integration, CPS/IIoT, Cloud Computing, Digital Twin) and explained our industry’s relative status and recommended actions in each. one of the conclusions from his very disciplined treatment of the topic is that “Smart Manufacturing is essentially a connectivity problem” – and we couldn’t agree more!

• “Lithography Control is Data Hungry” by Tom Hoogenboom of ASML – his illustration of just how precise litho metrology has become was brilliant: controlling exposure and registration at the 5nm node on a 300mm substrate is like moving your chair in the conference meeting room by 1 mm and having an airborne observer of a 300km diameter region know it happened!

Finally, as in many prior years, Cimetrix was privileged to present at this conference, as Alan Weber delivered a talk entitled “EDA Applications and Benefits for Smarter Manufacturing.” This presentation described the potential use of SEMI EDA (Equipment Data Acquisition) standards to improve the performance and benefit of a range of manufacturing applications; it also included a specific ROI case study for the use of EDA in the all-important FDC (Fault Detection and Classification) application to reduce the false alarm rate and the severity of process excursions. If you want to know more, you can request to view a copy of the entire presentation.

However, it wasn’t all work and no play… The local sponsors, GLOBALFOUNDRIES, Infineon, and XFAB, hosted the conference banquet at the picturesque Adam’s Gasthof in the nearby city of Moritzburg.

In addition to all the food and libation one could possibly consume, the participants were feted with a torchlight walking tour of the town and its iconic Moritzburg Castle. All in all, German hospitality and history at its best.  

The insights gained from these and the other 30+ presentations are too numerous to list here, but in aggregate, they provided an excellent reminder of how relevant semiconductor technology has become for our comfort, sustenance, safety, and overall quality of life.

This (apc|m) conference and its sister conference in the US are excellent venues to understand what manufacturers do with all the data they collect, so if this topic piques your interest, be sure to put these events on your calendar in the future. In the meantime, if you have questions about any of the above, or want to know how equipment connectivity and control fit into the overall Smart Manufacturing landscape, please contact us!

Over the past several months, we’ve highlighted the importance of explicit and standardized models in the context of equipment communications interfaces and some of the “smart” factory applications they support. The manufacturing stakeholders impacted by these applications run the gamut from process, equipment, maintenance, and industrial engineering to production operations to traceability regulatory compliance… yet these only scratch the surface.

The question you may be asking now is “So what?” or “What should I do with this information?” The answer to these important questions depends on your company and your role. 

For example, if you’re part of a semiconductor manufacturing enterprise in today’s market environment, you know that you can probably sell every good device you make, so there is intense pressure to simultaneously maximize product quality, volume, and [factory and engineering] productivity–a perfect storm. Since lead times for new equipment needed for capacity expansion are at all-time highs, this means getting as much as you can out of your existing facilities while waiting for new deliveries. New applications to monitor and improve these KPIs are being developed continuously, but the one thing they have in common is a reliance on detailed, high quality, easily accessible and interpretable equipment data.

For 300mm equipment with the latest generation of SEMI EDA (Equipment Data Acquisition) interfaces, this means having “good” E120/E125/E164-compliant equipment metadata models as a foundation. On top of this foundation, however, the models must also include the specific parameters, events, state machines, and other items that fully describe the behavior of the equipment according to your unique manufacturing requirements… which can only be achieved by mapping these requirements into specific equipment model elements, and updating your purchase specifications to close whatever gaps you find between what is currently offered by the equipment suppliers and what you really need. Fortunately, we have been through this process a number of times, and can help clarify your manufacturing priorities and translate them directly into updated interface purchase specifications.

Admittedly, this may take some time, but remember that you always only get what you are willing to accept. It brings to mind the old adage: “The best time to plant a tree was 20 years ago; the second 

best time is today.” 

As another example, if you are part of the embedded control system development team of an equipment supplier, you can anticipate not only increasingly explicit model content requirements, but also more stringent performance and testing requirements for the standard EDA communications interface as your customers raise their reliance on this technology to realize manufacturing competitive differentiation. We at Cimetrix have seen this demand build over the past 18 months, and are well prepared to support you throughout the entire equipment development life cycle.

This article is the sixth and final in the series announced earlier this year in the Models in Smart Manufacturing blog series. From here, we’ll soon begin a new series on advanced EDA applications and benefits based on best practices of the industry leaders – be sure to watch for this early next year!

We look forward to your feedback and to sharing the Smart Manufacturing journey with you.

*The visualizations of equipment metadata model fragments are those produced by the Cimetrix ECCE Plus product (EDA Client Connection Emulator).

Austin, Texas was the site of this year’s conference, going back to its roots after almost 30 years. Because of its unique focus on equipment and process control technology for the semiconductor industry, and the consistently high quality of its technical content, this conference continues to attract both industry veterans and newcomers to this domain, with this year’s attendance over 160.

Cimetrix has been a regular participant and presenter at this event, and this year was no exception. Alan Weber made a presentation entitled “ROI-based Approach for Evaluating Application Data Collection Use Case Alternatives” that was jointly developed with Mark Reath of GLOBALFOUNDRIES. The key message of this talk was that data collection should not be viewed as an all-or-nothing proposition but rather a spectrum of alternatives within which an approach can be chosen that best fits the problem to be addressed. As examples, the presentation described specific FDC use cases that resulted in significant savings through reduced false alarm rate and fewer/less severe process excursions. For a copy of this presentation, follow the link at the bottom of this posting.

Boyd Finlay’s (GLOBALFOUNDRIES) keynote presentation was undoubtedly one of the highlights of the conference. His presentation, “Raising the Bar: Foundry Expectations for Equipment Capability and Control,” painted a compelling picture of how future semiconductor manufacturing equipment must be able to support the growing demand for semiconductors in almost all aspects of modern life, especially in self-driving cars and their supporting infrastructure. For example, one of the specific expectations is that “Fab engineers expect fully integrated instrumentation on and around equipment to provide well established unambiguous high-volume manufacturing sensor supporting BKMs (best-known methods).” This presentation is well worth your time to review regardless of your job function in the industry, so follow the link below for a copy.

Samsung also offered some very interesting insights in a presentation titled “Wafer Level Time Control for Defect Reduction in Semiconductor Manufacture FABs.” It correlated defect densities to position in the FOUP and explained 2 sources for these: 1) outgassing of wafers after certain kinds of processes (which can be addressed with N2 purging), and 2) the difference in post-process waiting time, which must now be considered at the individual wafer level rather than the lot as a whole.

This conference and its sister conference in Europe are excellent venues to understand what manufacturers do with all the data they collect, so if this topic piques your interest, be sure to put these events on your calendar in the future. In the meantime, if you have questions about any of the above, or want to know how equipment connectivity and control fit into the overall Smart Manufacturing landscape, please contact us!

As predicted, Cimetrix had a very busy and fruitful week (September 11-15) in Taiwan. In addition to hosting numerous customers, prospects, and friends at our booth, Cimetrix made multiple technical presentations focused on Smart Manufacturing, both at the show and at the eMDC Conference in Hsinchu. Two of these were jointly presented with Mark Reath of GLOBALFOUNDRIES. Use the links at the bottom of this post if you’d like a copy of this material.

In addition to our participation in these technical events, Cimetrix demonstrated the new Cimetrix EDATester™ product to a number of factory customers who now need a validated method for verifying incoming equipment compliance to the SEMI Equipment Data Acquisition (EDA) suite of standards. The timing for this product is ideal, based on the increased rate of adoption for these standards we have seen in Taiwan. 

Given the industry’s current momentum and near-term outlook, the mood in Taiwan is overwhelmingly positive, and the trade show almost had a celebratory quality to it. Fittingly, the Leadership Gala Dinner held Wednesday night was a feast for all the senses, from the food to the entertainment to the array of dignitaries who attended. 

For the second year in a row, President Tsai attended and expressed her gratitude for the industry’s role in advancing the quality of life across the nation and her administration’s unwavering support for its continued prosperity. Dr. Nicky Lu, one of Taiwan’s well-known business and technology icons, was honored with the industry’s most prestigious Leadership Award, and shared his personal perspective on some of the exciting semiconductor-enabled products now in the works. 

Dr. Lu went into even more depth about semiconductor technology evolution in his keynote address for the eMDC Conference (Joint Symposium of e-Manufacturing & Design Collaboration Symposium 2017 and ISSM 2017) on Friday, outlining a powerful vision that he’s labelled as “HIDAS: Heterogeneous Integrated Design/Architecture/System for Silicon-Centric Nano-System in Si4.0” – if you want to know more, you’ll want to contact him directly!

All in all, is was a great week to be in Taiwan, especially since Typhoon Talim decided to take a turn to the north without dampening the spirit of SEMICON. Please contact us with any questions, and we look forward to seeing you at future industry events.

Device Scaling vs. Process Control Scaling: Advanced Sensorization Closes the Gap

Smarter Manufacturing through Equipment Data-Driven Application Design

Smart Manufacturing Requirements for Equipment Capability and Control