Industry News, Trends and Technology, and Standards Updates

SMTA International is Going Virtual and Cimetrix will be There!

Posted by Kimberly Daich; Director of Marketing on Sep 23, 2020 11:45:00 AM

SMTAI2020-Masthead2

We are once again gearing up for a virtual show next week! SMTA International is going to be held virtually 28-30 September, 2020. We are excited to be exhibiting at this show for the first time! SMTA International (or Surface Mount Technology Association International) was established in 1984 and is a non-profit international association of companies and individuals involved in all aspects of the electronics industry. The association brings together a professional network of process engineers, executives, project managers, designers and technologists who are shaping the future of the electronics assembly industry.

For the first virtual SMTAi Conference, anyone can register for a free expo pass that also includes the Live Electronics Expo, (Mon-Wed 9/28 – 9/30), the Student and Young Professionals Program (Tues PM 9/29), the Women’s Leadership Program (Wed PM 9/20) and much more.

Cimetrix will have a virtual booth that will me manned by product experts throughout the 3-day expo. We will have live demo times available by reservation (you can sign up now or during the show!). We will also have videos and documentation that features our products and services.

Cimetrix Sapience® will be showcased at SMTAi. Sapience is a smart factory platform to seamlessly connect varying factory equipment within a single event-driven framework. The Sapience platform provides rapid-deployment tools for factories to mine the treasure trove of data available from shop floor equipment, driving actionable insights for optimal decision-making.

We would love to “see” you at the virtual SMTAi Conference next week! Be sure to stop by our booth and talk to us! There will be private chat and voice/video conferencing available from 9:30 am – 4:30 pm CT during the expo and we’d love to meet up and talk about your needs!

Schedule a Demo

Topics: Industry Highlights, Semiconductor Industry, Doing Business with Cimetrix, Events, Smart Manufacturing/Industry 4.0

SEMICON Taiwan 2020 is happening next week!

Posted by Kimberly Daich; Director of Marketing on Sep 15, 2020 6:00:00 PM

SEMICON Taiwan 2020 is coming soon and our Taiwan team will be there! You can read about it now in Traditional Chinese or below in English

semicon-taiwan-top-banner

SEMICON Taiwan將是SEMI的第一個全面的實體虛擬活動。這與Cimetrix的業務完全吻合,我們將在智能製造大廳的K3068號展位展出。

我們知道今年是史無前例的,許多人將無法前往台灣。但是,我們想邀請所有能夠參加展會的人前來參觀,看看Cimetrix的新功能! 您也可以在演出前隨時與我們安排會議)!

Cimetrix將在SEMICON Taiwan上展示我們的最新產品和尖端技術。這包括我們的設備控制平台演示,EDA產品以及GEM連接性和一致性測試產品。我們還將能夠提供有關SEMI標準和SEMI技術的一些最新更改的更新。

我們也很高興宣布今年的演講嘉賓:我們的新產品創新副總裁艾倫·韋伯(Alan Weber)和我們的台灣總經理李孟修(Michael Lee)將就“半導體智能製造:業務驅動器,技術的不斷發展的紐帶和標準”發表演講。於924日星期四上午11:30會見專家展位(J3146

祝大家安全健康地進行展覽。儘管我們的許多全球團隊都會錯過此次展會,但我們的台灣團隊和合作夥伴將隨時準備回答您的所有問題。我們希望看到你在那裡!

Meet with Us


semicon-taiwan-top-banner

SEMICON Taiwan will be SEMI’s first comprehensive physical-virtual event, and will take place during September 23-25 at TaiNEX 1 (Nangang Exhibition Center) in Taipei, Taiwan with the theme “Leading the Smart Future.” This is perfectly aligned with the business of Cimetrix, and we will exhibit in the Smart Manufacturing hall at booth K3068.

We know this year is unprecedented and many will not be able to travel to Taiwan. However, we would like to invite everyone who is able to attend the show to stop by and see what’s new with Cimetrix! (You can also schedule a meeting with us at any time before the show)!

Cimetrix will showcase our latest products and cutting-edge technologies during SEMICON Taiwan. This includes our equipment control platform demonstrations, EDA products and GEM connectivity and compliance testing products. We will also be able to give updates on some of the latest changes to the SEMI Standards and SEMI technologies.

We are also excited to announce our speaker this year: Alan Weber, our VP of New Product Innovations, and Michael Lee, our General Manager in Taiwan, will speak on the topic of “Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards” at the SEMI Meet the Experts Booth (J3146) on Thursday, September 24 at 11:30 a.m.

We wish everyone a safe and healthy exhibition. While many of our worldwide team will miss being at the show, our Taiwan team and our partners will be available and ready to answer all your questions. We hope to see you there!

Meet with Us

 

Topics: Industry Highlights, Semiconductor Industry, Doing Business with Cimetrix, Events, Smart Manufacturing/Industry 4.0

Summer 2020 North America DDA Task Force Report

Posted by Brian Rubow: Director of Solutions Engineering on Aug 12, 2020 10:45:00 AM

Background

The SEMI North America Diagnostic Data Acquisition (DDA) task force is part of the North America Information and Control Committee (I&CC or NA I&CC). This year the meeting that is normally held in conjunction with SEMICON West was held on Tuesday, July 14, 2020, and continued its activities in developing important SEMI standards. As co-leader of the NA DDA task force, I offer this blog as a summary of the current task force activities.

Freeze 3 Status

The primary responsibility of the DDA task force is the suite of Equipment Data Acquisition (EDA) standards, sometimes referred to as “Interface A.” Currently there are two version sets of EDA standards known as “Freeze 1” and “Freeze 2” which are both based on SOAP/XML over HTTP. The current activities are focused on defining the next EDA set (already designated “Freeze 3”) which is based on a binary protocol gRPC over HTTP. This technology, along with a number of other changes, promises to dramatically increase data collection throughput capacity.

Here is what has been completed so far:

Standard (Ballot)

Ballot Status

Lead

E132 (6337) – Client Authorization and Authentication

Published - 04/29/2019

Brian Rubow (Cimetrix)

E138 (6336) – Specification for XML Semiconductor Common Components

Published - 03/15/2019

Brian Rubow (Cimetrix)

E134 (6335) – Data Collection Management

Published – 03/29/2019

Inhyeok Paek (Link Genesis)

E120 (6434) – Common Equipment Model (CEM)

Published – 05/30/2019

Inna Skvortsova (SEMI)

E145 (6436) – Classification for Measurement Unit Symbols in XML

Published – 05/31/2019

Inna Skvortsova (SEMI)

E178 (6300) – Guide for EDA Freeze Version

Published – 01/10/2020

Mitch Sakamoto (ZAMA)

E179 (6344A) – Specification for Protocol Buffers Common Components

Published – 03/27/2020

Albert Fuchigami (PEER)

 

Current Ballot Activity

The bulk of the “Freeze 3” work is still under active development. Here is a summary of the ballot activity as of the start of the meeting on Tuesday.

Standard (Ballot)

Ballot Status

Lead

E125 (6527B) – Equipment Self Description (EqSD)

Adjudication

Brian Rubow (Cimetrix)
Hyungsu Kim (Doople)

E132 (6571B) – Client Authorization and Authentication

Adjudication

Mitch Sakamoto (ZAMA)
Albert Fuchigami (PEER)

E134 (6553B) – Data Collection Management

Adjudication

Brian Rubow (Cimetrix)

E164 – EDA Common Metadata

Development

Alan Weber (Cimetrix)
Note – separate 5yr reapproval ballot started

E125.2 (6345) – gRPC Binding for Equipment Self Description (EqSD)

Development

Albert Fuchigami (PEER)

E132.2 (6346C) – gRPC Binding for Client Authorization and Authentication

Adjudication

Albert Fuchigami (PEER)

E134.2 (6347) – gRPC Binding for Data Collection Management

Development

Albert Fuchigami (PEER)

 

All of the ballots failed and will be reworked for Cycle 7 voting later this year. However, this was not unexpected, and a great of useful feedback was gathered in the process.

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged at: http://downloads.semi.org/web/wstdsbal.nsf/TFOFandSNARFsbyCommittee?OpenView&Start=1&Count=1000&ExpandView

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. The North America DDA task force community is called “Diagnostic Data Acquisition Task Force - North America”.

To find out more about the semi standards, or to speak with a standards expert, click the button below:

Ask an Expert

Topics: Industry Highlights, Semiconductor Industry

Summer 2020 North America ABFI Task Force Report

Posted by Brian Rubow: Director of Solutions Engineering on Aug 5, 2020 11:00:00 AM

Background

The SEMI North America Advanced Backend Factory Integration (ABFI) task force is part of the North America Information and Control Committee (I&CC or NA I&CC). Normally this task force meets every July in San Francisco as part of SEMICON West. However, this year the technical committee meetings are spread out over several weeks and do not coincide directly with the exhibition. Additionally, the I&CC did not meet at all because SEMI regulations do not currently allow TC Chapter (Committee) voting in virtual meetings. That will hopefully change later this year, but for now delays SEMI standards development.

Regardless of these challenges, the ABFI task force did meet on Monday July 13, 2020 and continues to develop SEMI standards. I am co-leader of the NA ABFI task force along with Dave Huntley of PDF Solutions. This blog is a summary of the current task force activities.

Wafer Maps

Ballot 6648 to update to the SEMI E142 (Specification for Substrate Mapping) specification has passed initial voting and is recommended to be accepted and published. This ballot significantly enhances the amount of traceability data that may be embedded within wafer maps.

Additional Wafer Map Activity

Because wafer maps will potentially be much larger with additional traceability data, they could be too large for the messages currently defined in the E142.2 standard. A new activity has been started to modify wafer map usage further and to allow Stream 21 messages to be used for wafer map transfer. The stream 21 message in the SECS-II standard can be used to transfer very large items through a GEM interface.

SEMI Standard Usage Matrix for Backend

The ABFI task force is also defining a matrix that specifies which standards beyond GEM (E30), SECS-II (E5), HSMS (E37) and Substrate Mapping (E142) should be used for backend automation, and under what conditions they should be used. This includes consideration of the full suite of GEM 300 standards and other standards that all GEM interfaces should consider, such as SEDD (E172) and SMN (E173).

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged at http://downloads.semi.org/web/wstdsbal.nsf/TFOFandSNARFsbyCommittee?OpenView&Start=1&Count=1000&ExpandView

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. The North America ABFI task force does not have a community.

To learn more about the standards, or to speak with a standards expert, click on the button below:

Ask an Expert

Topics: Industry Highlights, Semiconductor Industry, Standards

Summer 2020 North America GEM 300 Task Force Report

Posted by Brian Rubow: Director of Solutions Engineering on Jul 22, 2020 10:45:00 AM

Background

The SEMI North America GEM 300 task force is part of the North America Information and Control Committee (I&CC or NA I&CC). Normally this task force meets in San Francisco as part of SEMICON West. However, this year the technical committee meetings are spread over several weeks and don’t coincide directly with SEMICON West. Additionally, the I&CC did not meet at all because SEMI regulations do not currently allow TC Chapter (Committee) voting in virtual meetings. That will hopefully change later this year, but for now inhibits the pace of SEMI standards development.

However, the GEM 300 task force did meet on Monday July 13, 2020, and continues to develop SEMI standards. I am co-leader of the NA GEM 300 task force, along with Chris Maloney from Intel. This blog is a summary of the current task force activities.

Pre-Meeting Summary

The table below contains a summary of the worldwide activities related to the GEM 300 task force as of the start of this summer’s meeting. There are corresponding task forces in the Japan and South Korea regions which are also active.

Region

Ballot

Standard(s)

Status

Topic

South Korea

5832

New

Cycle 5, 2020

Generic Counter

North America

6348

E30

Published

SEMI style/regulation conformance

North America

6572

E30

Development

Add Stream 21, Cleanup Process Program Management.

North America

6552

E5

Cycle 5, 2020

Data collection setup, terminology

North America

6598

E37, E37.1

Cycle 5, 2020

Standardize TCP/IP port numbers

North America

6597

E173

Adjudication Pending

Minor updates, clarification

Awaiting I&CC adjudication from cycle 2, 2020 voting (no negatives) and the task force recommendation from Spring 2020.

North America

6647

E116

Development

Recommendations from the ABFI task force

 

Current Ballot Activity

Two ballots were adjudicated during the most recent GEM 300 task force meeting. For those of you new to the standards development process, the term “adjudication” means that we review the results of the voting and recommend handling of all negative votes and comments received. The recommendations by the task force are then presented to and finalized at the committee level. Since the North America I&CC did not meet, the failed and super-clean ballots are being transferred to other regions (probably Taiwan) for further processing. Passed ballots with any negatives or comments are put on hold until NA I&CC meets so that the merits of the comments and overridden negatives can be evaluated.

6552A E5

This ballot modifies the E5 SECS-II standard. The ballot included three line-items, each of which is voted on separately

  1. This is the most exciting activity in this ballot because it will give GEM host software much better tools for managing and testing GEM data collection. The first line item proposed adding several new messages to the E5 standard including a message to:
    1. Query the list of defined report identifiers
    2. Query report definitions
    3. Query a list of event report links
    4. Query the list of enabled events (this could already be done using Status Variable EventsEnabled)
    5. Query the list of streams and functions configured for spooling
    6. Query the list of defined trace identifiers
    7. Query trace definitions
  1.  
  2. Establish proper definitions for status variables, data variables and equipment constants. Additionally, deprecate the usage of the data item “DVNAME” which has generated confusion for years since it means a data variable identifier and not a data variable name.
  3. Clarify the usage of message S7F17/F18. This message allows deletion of one or more recipes, but only returns a single acknowledgement code. The new clarification defines what to expect when an error is returned.

Each of the line items had at least one comment or negative; therefore, none was super-clean. The GEM 300 task force decided to pass line items 1 and 3, but fail line item 2.

6598A E37

The primary purpose of this ballot is to clarify some confusing text related to the T8 timer. Additionally, there are other improvements related to recommended settings. The GEM 300 task force decided to fail this ballot.

New Ballot Activity

Here is a summary of the next set of ballots to expect from the NA GEM 300 task force planned to be presented for Cycle 7 voting later this year.

Ballot

Specification

Description

6552B

E5

A rework of ballot 6552A line item #2, which is described above.

6598B

E37

A rework of ballot 6598A described above.

6647

E116

Recommendations from the ABFI task force to allow the GEM host to declare scheduled/unscheduled down time and for the equipment to declare an Engineering mode. This will allow E116 to map better to E10.

6572

E30

A major change to the GEM standard to officially allow usage of Stream 21 for large unformatted recipes and E172 SEDD files, deprecation of some little used recipe alternatives like E42, implementation of the new E5 messages from ballot 6552A line item #1, and several other enhancements.

Note that the ballot number will be changing due to a late scope change.

?

E148

Upgrade NTP from version 3 to version 4.

 

Getting Involved

For those interested in participating, it is easy to join SEMI standards activities. Anyone can register at www.semi.org/standardsmembership.

All SEMI task force ballot activities are logged at http://downloads.semi.org/web/wstdsbal.nsf/TFOFandSNARFsbyCommittee?OpenView&Start=1&Count=1000&ExpandView

After joining the standards activities, anyone can get involved. The task forces post everything on the connected @ SEMI website https://connect.semi.org/home. The North America GEM 300 task force community is called “GEM 300 Task Force - North America”.

To find out more about SEMI Standards, GEM300, or to talk to standards expert, click the button below. 

Ask an Expert

Topics: Industry Highlights, SECS/GEM, Semiconductor Industry, GEM300

SEMICON China 2020 Pressed Forward Successfully

Posted by Lewis Liu on Jul 15, 2020 11:45:00 AM

Read the Post-show report of the SEMICON China 2019 show today. Read it now in Chinese or below in English.

semicon-china-2020-image  一年一度为期3天的半导体盛会SEMICON China 2020于6月27-29在上海新国际博览中心顺利举行并落下帷幕。展会汇集了业内八百余展商,一起交流探讨,共享半导体行业技术和市场动向。此次盛会是后疫情期电子半导体行业的首展。由于疫情,暴雨和端午佳节诸多因素影响, 参加人数比往年有所减少,但是在如此艰难的情况下,半导体人还能克服困难,聚集在此举办盛会,已经算是非常成功!2020年恰巧是SEMI国际半导体产业协会的50岁生日,这也给此次聚会赋予了特殊的意义!
作为SEMI国际半导体产业协会最紧密并且历史最悠久的合作方之一,矽美科一如既往的参加了此次展会。在中国区技术负责人刘波和黄玉峰的主持下,我们展示了矽美科行业领先的符合SECS/GEM, GEM300, EDA/Interface A等SEMI标准的互联软件产品。 我们不仅见到了一批老朋友,也相识了 一批新朋友,大家一起交流市场和技术信息,畅谈合作共赢机会!

SEMICON-China-pic1


展会期间,我们也预定了SEMICON CHINA 2021的展位。我们将和SEMI及所有半导体人一起长期坚持不懈的耕耘在这个伟大的行业,希望能为中国乃至全球电子半导体行业做出力所能及的贡献!我们明年再会!

要了解更多关于Cimetrix产品和服务的信息,您可以随时安排会议。

Schedule a Meeting


semicon-china-2020-imageThe annual three-day SEMICON China 2020 event, originally scheduled for March, was successfully held at the Shanghai New International Expo Center June 27-29, 2020. Despite the lack of international travelers, the exhibition brought together more than 800 exhibitors who exchanged, discussed, and shared semiconductor industry technology and market trends. This event was the first exhibition of the electronic and semiconductor industries in the COVID-19 period. Due not only to the pandemic but also other factors such as bad weather and the Dragon Boat Festival, there were fewer participants than in previous years. However, given these circumstances, our industry in China overcame the difficulties and gathered in Shanghai to celebrate the 50th birthday of the SEMI organization—this gave the show an extra special meaning!

SEMICON-China-pic1As a longstanding member and collaborative partner of SEMI, Cimetrix has now participated in this exhibition for several years. With the support of Clare Liu and Yufeng Huang, the company’s principal technologists in China, Cimetrix showed its industry-leading connectivity software products that meet GEM, GEM300, EDA/Interface A and other SEMI standards. We not only spent time with old friends, clients and colleagues, but also met many new people that represent an opportunity to learn and grow. 

Finally, during the exhibition, we booked the booth space for SEMICON CHINA 2021. We are excited to support and participate in the Chinese semiconductor manufacturing industry, to anticipate where the industry is headed, and to work together in meeting the future challenges head on.

To learn more about Cimetrix products and services, you can schedule a meeting any time.

Schedule a Meeting

Topics: Semiconductor Industry, Doing Business with Cimetrix, Events, Smart Manufacturing/Industry 4.0

Semiconductor Back End Processes: Adopting GEM Judiciously

Posted by Brian Rubow: Director of Solutions Engineering on May 14, 2020 10:20:17 AM

Equipment Communication Leadership in Wafer Fabrication

For many years the semiconductor industry’s wafer fabrication facilities, where semiconductor devices are manufactured on [principally] silicon substrates, have universally embraced and mandated the GEM standard on nearly 100% of the production equipment. This includes the complete spectrum of front end of line (FEOL – device formation) and back end of line (BEOL – device interconnect) processes and supporting equipment. Most equipment also implement an additional set of SEMI standards, often called the “GEM 300” communication standards because their creation and adoption coincided with the first 300mm wafer manufacturing. Interestingly, there are no features in these standards specific to a particular wafer size.shutterstock_405869995_backend

Together, the GEM and GEM 300 standards have enabled the industry to process substrates in fully automated factories like Micron demonstrates in this video and GLOBALFOUNDRIES demonstrates in this video.

Specifically, the GEM 300 standards are used to manage the following crucial steps in the overall fabrication process:

  • automated carrier delivery and removal at the equipment
  • load port tracking and configuration
  • carrier ID and carrier content (slot map) verification
  • job execution where a recipe is assigned to specific material
  • remote control to start jobs and respond to crisis situations (e.g., pause, stop or abort processing)
  • material destination assignment after processing
  • precise material location tracking and status monitoring within the equipment
  • processing steps status reporting
  • overall equipment effectiveness (OEE) monitoring

Additionally, the GEM standard enables

  • the collection of unique equipment data to feed numerous data analysis applications such as statistical process control
  • equipment-specific remote control
  • alarm reporting for fault detection
  • interaction with an equipment operator/technician via on-screen text
  • preservation of valuable data during a communication failure

Semiconductor Back End Process Industry Follows the Lead

After wafer processing is completed, the wafers are shipped to a semiconductor back end manufacturing facility for packaging, assembly, and test. Historically this industry segment has used GEM and GEM 300 sporadically but not universally. This is now changing.

In North America, SEMI created a new task force called “Advanced Back end Factory Integration” (ABFI) to organize and facilitate this industry segment’s implementation of more robust automation capabilities. To this end, the task force is charged with defining GEM and GEM 300 support in back end equipment, including processes such as bumping, wafer test, singulation, die attach, wire bonding, packaging, marking, final test and final assembly. As its first priority, the task force has focused on updating the SEMI E142 standard (Substrate Mapping) to enhance wafer maps to report additional data necessary for single device traceability. Soon the task force will shift its focus to define GEM and GEM 300 back end use cases and adoption more clearly.

Why GEM?

GEM was selected for several reasons.

  • A lot of the equipment in the industry already have GEM interfaces.
  • GEM provides two primary forms of data collection that are suitable for all data collection applications. This includes the polling of equipment and process status information using trace reports where the factory can collect selected variables at any frequency. Additionally, collection event reports allow a factory system to subscribe to notifications of just the collection events it is interested in, and to specify what data to report with each those collection events.
  • Most of the equipment suppliers have GEM experience either from implementing GEM on the back end equipment or from implementing GEM on their frontend equipment.
  • Factories can transfer experienced engineers from semiconductor frontend facilities into the back end with the specific goal of increasing back end automation.
  • GEM has proven its flexibility to support any type of manufacturing equipment. GEM can be implemented on any and all equipment types to support remote monitoring and control.
  • GEM is a highly efficient protocol, publishing only the data that is subscribed to in a binary format that minimizes computing and network resources.
  • GEM is self-describing. It takes very little time to connect to an equipment’s GEM interface and collect useful data.
  • GEM can be used to control the equipment, even when there are special features that must be supported. For example, it is straightforward to provide custom GEM remote commands to allow the factory to determine when periodic calibrations and cleaning should be performed to keep equipment running optimally.

Improved Overall Equipment Effectiveness Tracking

The ABFI task force has already proposed some changes to the SEMI E116 standard (Specification for Equipment Performance Tracking, or EPT). EPT is one of several standards that can be implemented on a GEM interface to provide additional standardized performance monitoring behavior beyond the GEM message set. This standard already enables reporting when equipment and modules within the equipment are IDLE, BUSY and BLOCKED. A module might be a load port, robot, conveyor or process chamber. When BUSY, this standard requires reporting what the equipment or module is doing. When BLOCKED, this standard requires reporting why the equipment or module is BLOCKED.

After analyzing the requirements of the back end industry segment, the task force decided to adopt and enhance the EPT standard. For example, the current EPT standard does not make any distinction between scheduled and unscheduled downtime. However, a few minor changes to E116 would allow the factory to notify the equipment when downtime is scheduled by the factory, greatly enhancing the factory’s ability to track overall equipment effectiveness and respond accordingly.  

Additional Future Work

Many of the GEM 300 standards can be applied to some of the back end equipment when applicable and beneficial. The task force is defining specific functional requirements and evaluation criteria to make these determinations and publish the resulting recommendations in a new standard. Representatives from several advanced back end factories are already closely involved in this work, but more participation is always welcome. For more information, click the button below!

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Topics: Industry Highlights, SECS/GEM, Semiconductor Industry, Customer Support, Doing Business with Cimetrix, Cimetrix Products

Cached Data: A New Feature in EDA Freeze 3

Posted by Brian Rubow: Director of Solutions Engineering on Jan 22, 2020 11:15:00 AM

Background

Several years ago, I was working with a client implementing EDA who wanted to collect data at higher than typical rates using the EDA trace data collection feature (essentially periodic data polling). The typical EDA data collection rate I was used to was 10 Hz, with a couple of clients implementing 20 Hz or even 40 Hz. This client, however, wanted to collect data at about 1000 Hz. This was a lot faster than we normally could accomplish, especially since the software timers and clock functionality in Windows are really designed for about 15 ms intervals. Therefore, the normal means of implementing the data collection was not going to work very well.

With a little creative thinking, I came up with a solution. Instead of using trace data collection, I decided to try event data collection. Every 1 second, I triggered an event notification and provided 1000 data samples with the event that had been collected at 1 ms intervals and stored. The 1000 samples were presented to the EDA client as an array of data, which EDA supports directly, and this solution worked very well. I also found that this approach used surprisingly few resources to implement and transmit, largely because the data is so compact. It was also very reliable.

Although this event with array data solution worked in this very specific situation, there were a few drawbacks. First of all, the client could not choose the data collection interval. Normally with trace data collection the client chooses the data collection rate to meet the needs of a specific data collection application. Secondly, the client receiving the data had to know what the data meant. The client application software had to be programmed to understand that each value in the 1000 sample array represented data collected every 1 ms. Finally, I could not use the trace start trigger and stop trigger to automatically enable and disable the reporting of the data collected. Normally, trace data collection can be started and stopped automatically to collect data between specific equipment events, which is a nice feature to focus data collection between specific processing steps or other meaningful activities.

EDA Freeze 3

A couple of years ago, the SEMI North America DDA (Diagnostics and Data Acquisition) task force, which I co-lead, decided to begin work on the next version of the EDA standards suite, commonly referred to as EDA Freeze 3. As part of this work, I raised an issue that I wanted our task force to address. That is, I wanted to be able to collect data using the EDA standard at higher frequencies than the typical 10 Hz available using today’s trace data collection. In particular, I wanted to leverage what I had learned using the event data array solution to report data collection at 1000 Hz and faster, and make this an integral part of the EDA standard without the limitations of my current solution. This new feature is now called Cached Data.

Cached Data Features

The basic principle behind this new feature is simple. First, allow the EDA client to define a Cached Data Request and specify the reporting frequency, data collection frequency, and other attributes like the number of samples, a start trigger, a stop trigger, and whether or not the triggers are cyclical. Then have the EDA server report the data for each parameter as a compact data array.

For example, an EDA client might ask for a parameter at a collection interval of 0.1 ms (10 KHz) and a reporting interval of 1 second. The result would be a set of Cached Data Reports that look like this:

EDA-Freeze-3-1-1

The equipment would collect the data every 0.1 ms and store the values for 1 second, and then send the Cached Data Report with the collected values in a tightly packed array. The EDA client would receive the data once per second and would know the data collection frequency.

Limitations

There are some limitations to the Cached Data proposal. For example, this type of data array reporting is only practical for some data types like integers, floats, Booleans and bytes. This type of data reporting is not practical for structured data or strings. Moreover, not all data can or should be collected at such high rates. Collecting data at these high rates requires robust software specifically designed for high-speed data collection. Therefore, the EDA proposal includes a way for parameter metadata to specify where the cached data feature can be used, and includes the specific minimum and maximum data collection frequencies. Therefore, the Cached Data feature is expected to be used for a limited subset of the available parameters for which the EDA server is specifically designed to provide such high-speed data collection.

gRPC & Protocol Buffers

The proposed EDA Freeze 3 standards also include the use of gRPC and Protocol Buffer technology, thereby moving EDA away from SOAP/XML over HTTP. gRPC with Protocol Buffers is a solution for a binary interface. Prelimiary test results reported to the DDA task force show dramatic throughput improvements and reduced bandwidth requirements for EDA. Additionally, the testing confirmed that reporting data in compact arrays is far more efficient for transmitting large amounts of data. In other words, the Cached Data feature is expected be even more effective due to this EDA protocol change.

SEMI Voting

Soon a new voting cycle for SEMI standards will begin where we vote on new versions of the standard. The Cached Data feature is included in two SEMI ballots: ballot 6553, a major revision of the SEMI E134 SPECIFICATION FOR DATA COLLECTION MANAGEMENT, and ballot 6527, a major revision of the SEMI E125 SPECIFICATION FOR EQUIPMENT SELF DESCRIPTION. Both are planned for voting in SEMI voting cycle 2 in 2020. Task force members are currently reviewing the latest revision of the proposed ballots.
Studies have already shown vast improvements in factory applications when collecting data at 10 Hz instead of 1 Hz. The increased performance of EDA Freeze 3 will allow the industry to dramatically improve manufacturing processes even more when data can be collected and reported at rates of 1000 Hz, 10 KHz, and beyond.

Topics: Industry Highlights, Semiconductor Industry, EDA/Interface A, EDA Best Practices

Cimetrix Korea presents the 5th Annual EDA/Interface A Seminar in Seoul - Registration is open now!

Posted by Hwal Song on Dec 26, 2019 5:45:00 PM

Cimetrix Korea is happy to announce that the 5th EDA (Equipment Data Acquisition) Seminar will be held on January 15th, 2020. It will be co-hosted with Linkgenesis, the regional distributor of CIMPortal Plus, the EDA suite from Cimetrix.

As EDA has expanded its footprint as the preferred industry standard among leading IDMs in the world of big data, AI, Machine Learning, and Industry 4.0, equipment makers face the challenges of delivering the new requirements of EDA without fully understanding its fundamental objectives, technologies, and benefits.

This seminar is designed with highly practical sessions where speakers will share their personal experiences and insights as developers to help software engineers at the equipment suppliers understand the most efficient ways to implement robust EDA interrfaces.

For registration and questions, please email Ian Ryu (ian.ryu@cimetrix.com).

Topics include the following:

  1. Global and domestic EDA trends, including Freeze III, that will introduce major performance improvements.
  2. EDA spec review – A summary of key contents from the newest and most demanding EDA specifications that a developer must know.
  3. EDA modeling methodology and important lessons learning that Cimetrix engineers have gained while supporting many new EDA customers.
  4. Testing methodology used during development and needed for EDA acceptance to ensure that standards compliance and interface performance expectations are met.
  5. Other general topics
    a-Software roadmap for equipment makers
    b-Smart factory

We look forward to seeing you at the seminar!


씨메트릭스 코리아는 파트너사인 링크제니시스와 공동으로 제5회 EDA 세미나를 2020년 1월 15일에 개최하게 되었음을 기쁘게 생각합니다. 최근 몇년 간 EDA가 국내뿐 아니라 해외 반도체 제조사에서 빅데이터, AI, 인더스트리 4.0에 부응하기 위해 업계 표준으로 자리를 잡아감에 따라, 여러 장비회사들은, 복잡한 EDA 요구사항을 충분히 이해하지 못한 상황에서 관련된 요구사항을 개발해야하는 도전에 처해 있는 상황입니다.

한국에서 개최되는 금번 세미나는 실용적인 방법론을 최대한 강조한 세션들로 구성되어, 발표자들이 지난 수년 동안 쌓은 개발자로서의 경험과 통찰력을 최대한 공유함으로 참가한 개발자분들이 각자의 회사로 돌아가 EDA 인터페이스를 개발할 때, 최선의 개발 및 디자인 선택을 할 수 있도록 하였습니다.

참석하시는 분들에게 실전에 도움이 되는 유익한 시간이 되시리라 생각됩니다.

세미나 등록이나 기타 질문은 유종하 팀장 (ian.ryu@cimetrix.com)에게 연락 주시기 바랍니다.

세션은 아래와 같이 진행됩니다.

  1. EDA의 국내외 동향(FREEZE III 포함) EDA 관련 업계 현황과 큰 성능개선을 기대하는 Freeze III 소개
  2. EDA Spec Review : 개발자로서 알아야 할 새롭고 복잡한 EDA  스펙의 키포인트 정리
  3. EDA 모델링 개발 지원 경험 공유 – EDA를 신규 개발하는 여러 회사를 지원하며 축적된 경험 공유 및 방향성 제시
  4. 개발 및 납품 시 테스트 방법론 – 개발과 검수 효율성을 향상
  5. 일반 주제
    1. 장비회사에서 가져야 할 소프트웨어 로드맵
    2. 스마트팩토리 솔루션

감사합니다.

Topics: Industry Highlights, Semiconductor Industry, EDA/Interface A, Doing Business with Cimetrix, Events

Why implement a SECS GEM driver?

Posted by Brian Rubow: Director of Solutions Engineering on Dec 12, 2019 2:15:00 PM

A SECS GEM driver can be looked at from a factory or equipment supplier perspective. I will discuss both of them in that order.

Factory Perspective

A little background:

semiconductor-factory-1

From a factory perspective, a SECS GEM driver is the host software that talks to an equipment’s GEM interface. It allows the factory to take advantage of the features implemented in each equipment’s GEM interface. However, what the factory can do with an equipment’s GEM interface is also limited by what the equipment supplier has included in that interface. The GEM standard is very flexible and scalable, which accounts for the widespread and growing adoption of GEM technology—it can be adapted to any manufacturing equipment and market segment.

It is possible to implement features in a GEM interface. But this also means that just having a GEM interface on the equipment does not ensure that it has been correctly designed to meet the factory’s expectations. An equipment supplier’s poor implementation of GEM can frustrate a factory’s plans for Smart Manufacturing by not providing features that the factory expects that could have been implemented. The tendency of most equipment suppliers is to implement the absolute minimum functionality in a GEM interface to save money. Therefore, it is the responsibility of the factory during equipment acceptance to evaluate the GEM interface to make sure that it is robust and has the full set of required features. The factory must have a clear vision of its needs both initially and later as its Smart Manufacturing goals are realized. It is not unusual for a factory to request an upgrade to an equipment’s GEM interface with more features, but these modifications usually come at a cost.

Although a factory’s SECS GEM driver must be adaptable to different suppliers’ GEM implementations, it only needs to support the specific features that the factory uses. For example, if the factory is only concerned about alarm and event report notification, then it does not need to support the messages for recipe management, remote control or trace data collection. As such, the investment in a SECS GEM driver is proportional to the number of GRM features that are utilized. However, the SECS GEM driver should also support variations in alarm and collection event implementations, because each equipment type will support a unique set of alarms and a unique set of collection events with unique data variable for event reports. Moreover, from equipment type to equipment type, the same collection ID might have different meanings. The SECS GEM driver therefore needs an ability to adapt by having a method to characterize the GEM implementation (such as a list of available collection events) and the ability to map a general capability to the actual implementation (such as “material arrived” = collection event ID 5).

So why would a factory want to use SECS GEM technology?

factory-alan-1In order to reach the goals of Industry 4.0 and Smart Manufacturing, factories must be able to monitor and control manufacturing equipment remotely. Therefore the equipment must have a software interface to provide this functionality and the factory must be able to access and use this interface.

Factories could let the equipment suppliers choose their own implementation technologies for this kind of capability, but as a result, different suppliers might take a different approach for every equipment type. This would be tremendously expensive and resource intensive. It is far better to standardize on one or two technologies, and ideally, one that is proven to work and known to have all of the necessary features. This allows the factory to achieve its goals with minimum investment, focusing instead on using the equipment interface in creative ways to improve manufacturing.

SECS GEM is the most proven technology already widely used across the globe and supported by the most sophisticated and automated industry in the world; semiconductor manufacturing. It is also widely adopted several other industries, making it a safe choice. The range of production applications supported by SECS GEM data collection include productivity monitoring, statistical and feedback/feedforward process control, recipe selection and execution tracking, fault detection and classification, predictive maintenance, reliability tracking, and many more. By contrast, alternatives to SECS GEM have so far been demonstrated to be incomplete or immature solutions. 

What specifically can you do with the SECS GEM technology?

  1. Collection Events: Be notified when things happen at the equipment, such as when processing or inspection begins and completes, or when a particular step in a recipe is reached.
  2. Collection Event Reports: Collect data with collection events. The host chooses what data it wants to receive. For example, track the ID of material arriving and departing from the equipment, or components placed on a board.
  3. Alarms: Be notified when bad or dangerous things are detected, receive a text description of the alarm condition, and when the issue is cleared.
  4. Trace Data Collection: Tell the equipment to report status information (software and/or hardware data) at a specific interval. For example, track digital and/or analog sensors during processing at 10 Hz frequency.
  5. Recipes: Upload, download, delete and select recipes as desired, whether in ASCII or binary formats. Make sure that the right recipe is run at the right time to eliminate misprocessing and minimize scrap. Track when someone changes a recipe.
  6. Remote Commands: Control the equipment, such as when to start, stop, pause, resume and abort. Custom commands, such as calibrate, skip or anything else can be supported.
  7. Equipment Constants: Configure and track the equipment configuration settings remotely.
  8. Terminal Services: Interact with the equipment operator remotely or provide instructions for the operator.
  9. Extensions: There are numerous extensions to GEM that can be supported but are not yet form requirements. For example, implement wafer or strip maps from E142 to provide and report details about material in XML format.

Equipment Supplier Perspective

AdobeStock_12291008-1

From an equipment supplier’s perspective, a SECS GEM driver is the software used to implement GEM technology on the equipment. In other words, the software to create a GEM interface. The equipment-side software requirements are inherently more complex that the host SECS GEM driver. This is because the equipment-side features are precisely defined by the GEM standard and should be implemented to the fullest extent possible. By contrast, the host can really do whatever it wants, so a limited implementation may be sufficient. In an ideal situation, the equipment supplier will implement just enough features in its GEM interface to satisfy all of its customers and therefore ship an identical GEM interface to all its customers. It is up to the equipment supplier to decide what GEM features to implement and how to adapt them for a particular type of equipment, but the factory should provide clear expectations about its planned use of the interface. It is also the factory’s responsibility to qualify the GEM interface during equipment acceptance. Note that it is not uncommon for factories to withhold partial equipment payment until the GEM interface has also passed its own acceptance.

Some equipment suppliers include the GEM driver as a standard feature on all equipment. This is ideal because it makes the GEM interface much easier to support and distribute. Some equipment suppliers only install GEM when it is specifically purchased. This often results in installation problems because the field technicians may or may not be knowledgeable enough or specifically trained to do this correctly. Other equipment suppliers include the GEM driver on all equipment, but only enable it when the feature has been purchased. This is better than attempting GEM interface installation after equipment delivery because the GEM interface can often be enabled with a simple equipment configuration setting.

Here are some key reasons for implementing a SECS GEM driver:

1. “One ring to rule them all”

By implementing a GEM interface, an equipment supplier can avoid having to implement multiple interfaces. Because GEM is the most feature complete option, the it should be implemented first and Thoroughly integrated with the equipment control and user interface software. If other protocols must be supported, they can usually be mapped onto the GEM capabilities or a separate external system because they only include a subset of GEM functionality.

2. Equipment Supplier Application Software

If the GEM implementation includes support for multiple host connections, then the GEM interface can be used by the equipment supplier itself for many applications. For example, an equipment supplier can develop a software package that monitors and controls their specific equipment at a factory. This can run simultaneously and independently while the factory GEM host software is connected. Many factories are willing to buy applications from the equipment supplier that enhance the productivity of the equipment they have purchased. As an example, equipment suppliers are better equipped to develop predictive maintenance applications that determine when parts are approaching failure and need replacement. These applications can save the factory time and money by avoiding unscheduled downtime. Other applications can also be developed by equipment suppliers to analyze and optimize equipment execution.

3. Competitive Advantage

A well implemented GEM interface can differentiate a supplier’s equipment from that of its competitors. Factories are beginning to recognize the value in controlling and monitoring equipment remotely, and know that a poor GEM interface contributes nothing to a factory’s Smart Manufacturing initiatives. A GEM interface that goes the extra mile to be truly useful empowers the factory to excel at Smart Manufacturing and to be far more productive. Selling equipment in today’s market without a GEM interface is like selling a television without a remote. On the other hand, providing a fully featured GEM interface is like selling a smart television.

Final Words

Experts on GEM technology are available all over world. Because GEM is a mature industry standard and well defined, it can be implemented by anyone in a range of different programming languages and operating systems. however, to save time I recommend using a commercially available product rather than developing the complete GEM interface from scratch. This can save massive amounts of time and effort, and ensures the quality of the resulting implementation.

To speak with a Cimetrix GEM expert, or to find out more about our GEM software products, you can schedule a meeting by clicking the link below.

Ask an Expert

Topics: Industry Highlights, SECS/GEM, Semiconductor Industry, Smart Manufacturing/Industry 4.0